Presentation + Paper
17 May 2022 Multi-incident holography profilometry for low- and high gradient object
Author Affiliations +
Abstract
Digital holographic microscopy (DHM) is a non-contact, profilometric tool that allows obtaining microscopic object topography from captured holograms. However, the use of DHM is limited when the object under observation has a high gradient or is discontinuous. Multi-angle digital holographic profilometry (MIDHP) is an alternative solution for overcoming this limitation for measuring the topography with discontinuities. This method combines digital holography and multi-angle interferometry. The method requires a certain number of holograms that are processed into longitudinal scanning function (LSF). The topography of the object is recovered by finding the maxima of the LSF. MIDHP enables to enlarge the measurement range and provides a high axial resolution. This paper investigates MIDHP to measure surfaces with various (low and high) surface gradients. The calculations of LSF requires many Fourier Transforms (FT) and the computations are slow. In this paper, we improve LSF calculations by introducing two algorithms. The first algorithm reduces number of FT needed by applying summation in frequency domain. Second approach applies the method of 3D filtering, which improves the quality of the reconstructed shape. The introduced approaches are verified both numerically and experimentally.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Moncy S. Idicula, Patryk Mitura, Michal Józwik, Hyon-Gon Choo, Juan Martínez-Carranza, Kai Wen, and Tomasz Kozacki "Multi-incident holography profilometry for low- and high gradient object", Proc. SPIE 12138, Optics, Photonics and Digital Technologies for Imaging Applications VII, 121380L (17 May 2022); https://doi.org/10.1117/12.2624437
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KEYWORDS
Reconstruction algorithms

Holograms

Digital holography

Holography

Optical filters

Fourier transforms

3D metrology

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