Paper
23 April 1999 Use of poly test wafer volume fraction as an input to control a diffusion poly doping process
Stephen McDade
Author Affiliations +
Proceedings Volume 3742, Process and Equipment Control in Microelectronic Manufacturing; (1999) https://doi.org/10.1117/12.346247
Event: Microelectronic Manufacturing Technologies, 1999, Edinburgh, United Kingdom
Abstract
The process control of lightly doping polysilicon with Phosphine can be difficult. In high volume semiconductor manufacturing the equipment downtime and poor process performance associated with this type of process is expensive. Utilizing the volume fraction of the polysilicon test wafers, as measured on an ellipsometer, as input prior to dope, improvements to process performance and control as well as equipment downtime can be achieved.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stephen McDade "Use of poly test wafer volume fraction as an input to control a diffusion poly doping process", Proc. SPIE 3742, Process and Equipment Control in Microelectronic Manufacturing, (23 April 1999); https://doi.org/10.1117/12.346247
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Semiconducting wafers

Wafer testing

Doping

Chemical species

Process control

Silicon

Amorphous silicon

RELATED CONTENT

Magnetic doping of Ge quantum dots growth studies exploring...
Proceedings of SPIE (September 16 2014)
CVD growth of Ge films on graded Si1 xGex ...
Proceedings of SPIE (March 11 2008)
Megavolt Ion Implantation Into Silicon
Proceedings of SPIE (May 31 1984)
Macroporous silicon: material science and technology
Proceedings of SPIE (May 28 2004)
Mechanism for QBD failure in poly gates
Proceedings of SPIE (September 03 1998)

Back to Top