PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
Compact, multi-spectral laser sources emitting in the mid-infrared (mid-IR) are in high demand for applications. Integration of several multi-spectral, mid IR quantum cascade lasers on silicon-based waveguide platforms is a necessary step towards realization of functional and complex mid-infrared photonic integrated circuits. This paper focuses on the thermal aspects of integration of multi-spectral QCLs toward the integration of QCL chips on silicon-based platform. The experimental results registered by means of CCD-thermo-reflectance are supported by numerical simulations of heat dissipation. The effects of thermal cross-talk between individual emitters are presented and discussed, leading to design guidelines for placement of laser chips in mid-infrared integrated photonics systems.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.