Mix And Match-10x Reduction Wafer Steppers

Adonis Stephanakis; Harry L. Coleman

doi:10.1117/12.933569

13 September 1982 Mix And Match-10x Reduction Wafer Steppers

Adonis Stephanakis, Harry L. Coleman

Proceedings Volume 0334, Optical Microlithography I: Technology for the Mid-1980s; (1982) https://doi.org/10.1117/12.933569
Event: 1982 Microlithography Conferences, 1982, Santa Clara, United States

Abstract

The ability to view an area of a wafer and 10X stepper reticle, simultaneously on axis, has been used to match different 10X reduction wafer steppers. This paper defines the problem and discusses test results. Operational parameters, global alignment, and intra-field die alignment are discussed. Wafer distortion and field distortion are examined. Registration data gathered from visual and computer diagnostics, which support the conclusions, are discussed.

Citation Download Citation

Adonis Stephanakis and Harry L. Coleman "Mix And Match-10x Reduction Wafer Steppers", Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); https://doi.org/10.1117/12.933569

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available