Practical Photolithography For Modern Semiconductor Production

Walter G. Hertlein

doi:10.1117/12.975596

17 September 1987 Practical Photolithography For Modern Semiconductor Production

Walter G. Hertlein

Proceedings Volume 0811, Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection; (1987) https://doi.org/10.1117/12.975596
Event: Fourth International Symposium on Optical and Optoelectronic Applied Sciences and Engineering, 1987, The Hague, Netherlands

Abstract

The impact of some photolithographic processing parameters on the final production results in the modern semiconductor device manufacture and also their definition, is discussed under the aspect that microlithographic manufacturing processes are working closer to the limits of the technology. Quality engineering includes good characterization of all manufacturing steps, of all used equipment and materials, in order to minimize the appearance of variances arising either from inside or being imported from outside sources. The objective is to have fully controlled and understood processes, which yield well performing semiconductor devices at reasonable costs in todays production and which will allow further technological progress in the microelectronics industry.

Citation Download Citation

Walter G. Hertlein "Practical Photolithography For Modern Semiconductor Production", Proc. SPIE 0811, Optical Microlithographic Technology for Integrated Circuit Fabrication and Inspection, (17 September 1987); https://doi.org/10.1117/12.975596

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