Microelectronic test structures for feature placement and electrical linewidth metrology

Loren W. Linholm; Richard A. Allen; Michael W. Cresswell

doi:10.1117/12.187462

1 July 1994 Microelectronic test structures for feature placement and electrical linewidth metrology

Loren W. Linholm, Richard A. Allen, Michael W. Cresswell

Author Affiliations +

Proceedings Volume 10274, Handbook of Critical Dimension Metrology and Process Control: A Critical Review; 1027407 (1994) https://doi.org/10.1117/12.187462
Event: Microelectronic Processing '93, 1993, Monterey, CA, United States

Abstract

This paper presents a critical review of electrical test methods for determining feature placement with total measurement uncertainties below 10 nm and electrical linewidth for sub-half-micrometer design linewidths with measurement precision below 1 nm. Control of feature placement and control of linewidth have been and are expected to continue to be two of the most important challenges required in the manufacturing of advanced microelectronic devices. Traditional methods of measuring these parameters suffer from both measurement speed and equipment expense. Microelectronic test structures are electrical devices that are used to determine selected tool, process, device, material, or circuit parameters by means of electrical tests. They are supported by a variety of commercial test equipment often found in semiconductor manufacturing facilities. They provide low-cost, post-patterning metrology for determining both feature placement and electrical linewidth. Properly characterized test structures and measurement methods provide an economic means of determining the critical parameters needed to develop, control, and operate the next generation of patterning tools.

Citation Download Citation

Loren W. Linholm, Richard A. Allen, and Michael W. Cresswell "Microelectronic test structures for feature placement and electrical linewidth metrology", Proc. SPIE 10274, Handbook of Critical Dimension Metrology and Process Control: A Critical Review, 1027407 (1 July 1994); https://doi.org/10.1117/12.187462

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