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9 March 2020 Advanced laser material processing of steel and silicon (Conference Presentation)
Thomas Kiedrowski
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Proceedings Volume 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV; 1126705 (2020) https://doi.org/10.1117/12.2549526
Event: SPIE LASE, 2020, San Francisco, California, United States
Abstract
A main field of application for USP lasers is the fabrication of high-precision microstructures by ablation of bulk material. In the last 10 years, the output power of USP laser systems increased from around 10 W to several 100 W. This enables the increase of productivity of USP laser ablation processes by more than one order of magnitude. So far there is a leak of appropriate strategies and optical system to overcome limits based on heat accumulation. In this contribution, ablation strategies for steel and silicon by using far more than 100 W is deduced and presented.
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Thomas Kiedrowski "Advanced laser material processing of steel and silicon (Conference Presentation)", Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 1126705 (9 March 2020); https://doi.org/10.1117/12.2549526
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KEYWORDS
Laser processing
Silicon
Semiconductor lasers
Laser ablation
Biomedical optics
Haptic technology
Laser systems engineering
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