Delivering metal oxide photoresists for EUV: overcoming challenges to scaling (Conference Presentation)

Andrew Grenville; Benjamin Clark; Peter de Schepper; Michael Kocsis; Jason Stowers; Alan Telecky

doi:10.1117/12.2552894

24 March 2020 Delivering metal oxide photoresists for EUV: overcoming challenges to scaling (Conference Presentation)

Andrew Grenville, Benjamin Clark, Peter de Schepper, Michael Kocsis, Jason Stowers, Alan Telecky

Proceedings Volume 11326, Advances in Patterning Materials and Processes XXXVII; 1132610 (2020) https://doi.org/10.1117/12.2552894
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States

Abstract

In response to the growing demand for Inpria MOx EUV resists, we have brought online our high-volume manufacturing (HVM) production line, have built the necessary supporting qualified supply chain and have developed the associated quality systems. In this paper we will discuss challenges we overcame in scaling and will review data demonstrating new achievements in reproducibility and stability of MOx photoresists. We will also present recent advances in integrated patterning capabilities for specific use cases of Inpria resists in logic and memory applications on the NXE:3400 as well as an update of resist performance on the EUREKA MET5.

Conference Presentation

Citation Download Citation

Andrew Grenville, Benjamin Clark, Peter de Schepper, Michael Kocsis, Jason Stowers, and Alan Telecky "Delivering metal oxide photoresists for EUV: overcoming challenges to scaling (Conference Presentation)", Proc. SPIE 11326, Advances in Patterning Materials and Processes XXXVII, 1132610 (24 March 2020); https://doi.org/10.1117/12.2552894

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