Paper
15 February 1990 Multi-Chamber Deposition System And Its Application To Vlsi Manufacturing Process
Kenji Numajiri, Tetsuo Ishida, Nobuyuki Takahashi
Author Affiliations +
Proceedings Volume 1188, Multichamber and In-Situ Processing of Electronic Materials; (1990) https://doi.org/10.1117/12.963933
Event: 1989 Microelectronic Integrated Processing Conferences, 1989, Santa Clara, United States
Abstract
The rapid progress of VLSI processing technology has recently raised a new demand for production equipment which is capable of multiple processes sequentially in the multi-chamber system. Mutli-chamber concept seems to be the major trend in the efforts to achieve development and production of sub-micron devices.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kenji Numajiri, Tetsuo Ishida, and Nobuyuki Takahashi "Multi-Chamber Deposition System And Its Application To Vlsi Manufacturing Process", Proc. SPIE 1188, Multichamber and In-Situ Processing of Electronic Materials, (15 February 1990); https://doi.org/10.1117/12.963933
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KEYWORDS
Semiconducting wafers

Sputter deposition

Particles

Tungsten

Very large scale integration

Chemical vapor deposition

Metals

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