The paper describes the latest advancements in power upscaling of blue diode laser modules that rely on the same platform and assembly lines of the more common 9xx nm fiber coupled modules to obtain compact, high brightness, and high reliability devices. The new member of the family exploits a combination of spatial, polarization, and spectral multiplexing of wavelength stabilized chips to deliver up to about 180W in a 50 µm core - 0.22 numerical aperture fiber, with a beam parameter product lower than 4.5 mm · mrad. The high positioning accuracy enabled by the well tested machines used for the automatic assembly of the commercial off-the-shelf infrared multi-emitters allows using for the first time a single volume Bragg gratings to simultaneously lock an entire row of spatially multiplexed blue chips, easing the device manufacturability.
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