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Pulsed laser deposition has evolved into a production technology for growing thin film materials with properties which are challenging to obtain by classical deposition methods such as sputtering or sol-gel deposition. Novel wafer based PLD system technology based on powerful excimer lasers allows universities, institutes and foundries to add 30+ new materials and material systems to their deposition portfolio enabling fabrication e.g. of electro-optical materials, transparent conductive oxides and perovskites. Dielectric, ferroelectric and piezoelectric material depositions can also be performed in any desirable sequence and can run with a single wafer load-lock, cassette handler or integrated with pre-clean station as part of the Solmates cluster platform. Deposition results obtained with the latest 300 mm wafer platform will be discussed.
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Ralph Delmdahl, Oliver Haupt, Bart Berenbak, Lennart de Vreede, Arjen Janssens, "Pulsed laser deposition systems and lasers for pilot and volume production," Proc. SPIE 11989, Laser-based Micro- and Nanoprocessing XVI, 119890K (4 March 2022); https://doi.org/10.1117/12.2606173