Presentation
30 April 2023 From micro to nano, and beyond: measuring innovations
Author Affiliations +
Abstract
Seeing an increasingly critical role of MI in the semiconductor industry, in this keynote, we will first review the evolution of the MI technologies in the last few decades, and then discuss the challenges we are presently engaging in, focusing on the EUV era metrology topics: thin resist, 3D and massive measurement. Most importantly, as an obligation of one of the leading equipment suppliers in this field, we will present a vision for the future technologies, in response to the keynotes from the device makers in recent years, mainly focus on electron beam tools but also to cover a certain range of different field technologies.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhigang Wang and Byoungho Lee "From micro to nano, and beyond: measuring innovations", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 1249604 (30 April 2023); https://doi.org/10.1117/12.2664258
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KEYWORDS
3D metrology

Electron beams

Extreme ultraviolet

Industry

Metrology

Semiconductors

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