Simulating HV-SEM imaging of HAR and buried features

Benjamin D. Bunday; Shari Klotzkin; Douglas Patriarche; Yvette Ball; Maseeh Mukhtar; Kotaro Maruyama; Seul-Ki Kang; Yuichiro Yamazaki

doi:10.1117/12.2661179

27 April 2023 Simulating HV-SEM imaging of HAR and buried features

Benjamin D. Bunday, Shari Klotzkin, Douglas Patriarche, Yvette Ball, Maseeh Mukhtar, Kotaro Maruyama, Seul-Ki Kang, Yuichiro Yamazaki

Author Affiliations +

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124960W (2023) https://doi.org/10.1117/12.2661179
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

In this work, important use cases for HV-SEM will be explored by simulation, such as HAR hole / trench imaging with various profiles and depths, buried feature imaging to understand detection and effective resolution with depth for optical overlay cases, and buried defect and void detection, using a new improved electron beam simulator which greatly extends utility of JMONSEL, AMAG SimuSEM, enabling many complex simulation scenarios to be achievable with many improved outputs and other augmentations. The use of simulation designed experiments (DOEs) to predict best conditions and performance for the above applications will be demonstrated, along with some physical validation in the HV-SEM process space for the JMONSEL/SimuSEM physics kernel by reproducing a few cases in the literature and to experimental results on recent AMAG7 HAR measurement targets.

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Citation Download Citation

Benjamin D. Bunday, Shari Klotzkin, Douglas Patriarche, Yvette Ball, Maseeh Mukhtar, Kotaro Maruyama, Seul-Ki Kang, and Yuichiro Yamazaki "Simulating HV-SEM imaging of HAR and buried features", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124960W (27 April 2023); https://doi.org/10.1117/12.2661179

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