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31 July 2023 Parallel MEMS AFM for high-throughput semiconductor metrology and inspection (Erratum)
Zhenle Cao, Wyatt Sullivan, Benjamin D. Bunday, David Morris
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Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124963Q (2023) https://doi.org/10.1117/12.3005374
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States
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Publisher's Note: This paper, originally published on 27 April 2023, was replaced with a corrected/revised version on 31 July 2023. If you downloaded the original PDF but are unable to access the revision, please contact SPIE Digital Library Customer Service for assistance.
Cao, Sullivan, Bunday, and Morris: Parallel MEMS AFM for high-throughput semiconductor metrology and inspection (Erratum)
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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Zhenle Cao, Wyatt Sullivan, Benjamin D. Bunday, and David Morris "Parallel MEMS AFM for high-throughput semiconductor metrology and inspection (Erratum)", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124963Q (31 July 2023); https://doi.org/10.1117/12.3005374
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KEYWORDS
Inspection
Metrology
Atomic force microscopy
Microelectromechanical systems
Semiconductors
Advanced process control
Lithography
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