Formation of a low-dilution pure copper layer by wire-based laser metal deposition with blue diode laser

S. Yoshida; M. Mizutani; K. Takenaka; Y. Sato; M. Tsukamoto

doi:10.1117/12.3001994

12 March 2024 Formation of a low-dilution pure copper layer by wire-based laser metal deposition with blue diode laser

S. Yoshida, M. Mizutani, K. Takenaka, Y. Sato, M. Tsukamoto

Proceedings Volume 12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX; 128720F (2024) https://doi.org/10.1117/12.3001994
Event: SPIE LASE, 2024, San Francisco, California, United States

Conference Poster

Abstract

A pure copper layer was formed on the stainless-steel substrate with low-dilution layer by a Wire-based Laser Metal Deposition method (W-LMD) with a blue diode laser. Pure copper is an important material for realization of a carbon-neutral society because of excellent properties such as electrical and thermal conductivity. As the demand of copper increases, a wide variety of processing methods are required with high yields. Thus, the LMD method, which is one of the Additive Manufacturing (AM) technologies, is focus on this study. The W-LMD is the process in which a metal wire is fed to the laser irradiation point and melted and solidified to form a layer. Conventional W-LMD with near-infrared fiber laser has formed a layer of Fe-based alloy, Ti-based alloy, Ni-based alloy, and so on. However, it was difficult to form a pure copper layer since light absorption rate of copper in this region was less than 10%. Therefore, we focused on blue light at the wavelength 450 nm. It is because light absorption rate of copper in blue region is 60%. Thus, the high-power blue diode laser has been developed and installed the W-LMD system. In this study, the pure copper layer was tried to form on the SS304 substrate with our W-LMD system. As the results, copper layer was formed with a layer thickness of 388 μm and a dilution thickness of 22 μm at the output power of 500 W, stage sweep speed of 10 mm/s, and wire feeding rate of 10 mm/s.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

S. Yoshida, M. Mizutani, K. Takenaka, Y. Sato, and M. Tsukamoto "Formation of a low-dilution pure copper layer by wire-based laser metal deposition with blue diode laser", Proc. SPIE 12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX, 128720F (12 March 2024); https://doi.org/10.1117/12.3001994

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