Presentation + Paper
8 March 2024 Crack-free growth of UVC LEDs on 6-inch sapphire substrates using face-to-face high-temperature annealed AlN by production scale MOCVD
Author Affiliations +
Abstract
In this study, growth of crack-free AlGaN-based UVC LEDs using face-to-face high-temperature annealed AlN templates on 6-inch sapphire substrates was investigated by production scale metal-organic chemical vapor deposition (MOCVD). The utilization of face-to-face annealed sputtered-deposited thin AlN films templates successfully mitigated wafer bowing, leading to crack-free growth. Additionally, single-peak UVC emissions were obtained in the growth of 6-inch × 7-wafers, and the in-plane uniformity of (Max – Min) / Average was approximately 1.6%. Face-to-face high-temperature annealed AlN proves to be suitable for growing large-diameter UVC LEDs wafers, paving the way for mass production.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
J. Yoshinaga, K. Ikejiri, S. Koseki, K. Uesugi, and H. Miyake "Crack-free growth of UVC LEDs on 6-inch sapphire substrates using face-to-face high-temperature annealed AlN by production scale MOCVD", Proc. SPIE 12886, Gallium Nitride Materials and Devices XIX, 128860B (8 March 2024); https://doi.org/10.1117/12.2692614
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KEYWORDS
Light emitting diodes

Metalorganic chemical vapor deposition

Annealing

Aluminum gallium nitride

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