Photonic glass interposer with integrated optical waveguides for fiber-to-chip coupling

Lars Brusberg; Lucas W. Yeary; Seong-ho Seok; JungHyun Noh; Jason R. Grenier; Betsy J. Johnson; Chad C. Terwilliger; Jeffrey S. Clark

doi:10.1117/12.2692092

11 March 2024 Photonic glass interposer with integrated optical waveguides for fiber-to-chip coupling

Lars Brusberg, Lucas W. Yeary, Seong-ho Seok, JungHyun Noh, Jason R. Grenier, Betsy J. Johnson, Chad C. Terwilliger, Jeffrey S. Clark

Author Affiliations +

Proceedings Volume 12892, Optical Interconnects XXIV; 128920C (2024) https://doi.org/10.1117/12.2692092
Event: SPIE OPTO, 2024, San Francisco, California, United States

Abstract

A novel packaging solution is discussed where both optical and electrical connectivity can be fabricated using ion-exchange (IOX) waveguides integrated into a glass with thin film metallization for an electrical redistribution layer. Design and process aspects are discussed to support silicon photonic flip-chip assembly directly to the glass substrate. Low-loss evanescent coupling occurs between the IOX waveguides embedded in the glass and the photonic chips with high-density silicon nitride optical I/Os. This design enables low-cost assembly methods involving the pick and place alignment of optical components and offers connectivity with low-profile mechanical transfer (MT) ferrule-based fiber connectors.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Lars Brusberg, Lucas W. Yeary, Seong-ho Seok, JungHyun Noh, Jason R. Grenier, Betsy J. Johnson, Chad C. Terwilliger, and Jeffrey S. Clark "Photonic glass interposer with integrated optical waveguides for fiber-to-chip coupling", Proc. SPIE 12892, Optical Interconnects XXIV, 128920C (11 March 2024); https://doi.org/10.1117/12.2692092

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