Presentation + Paper
9 April 2024 Feature grouping to enable edge placement error-aware process control in multi-feature logic use case
Author Affiliations +
Abstract
The grouping method assisted EPE-aware control method is being explored in a multi-feature dual layer Logic use case. EPE metric is estimated using angle resolved optical Scatterometry based overlay and electron beam-based metrology (large field of view SEM) for the reconstruction of edge-to-edge distance between the Metal and Via pattern. In the setup phase, EPE sensitivities to dose and focus have been derived using data from a FEM wafer. EPE-aware optimization, using scanner dose and overlay control sub-recipes, outperforms traditional optimization in simulations showing reduced EPE max per die. This improvement suggests a potential increase in device yield through the adoption of EPE-aware control strategies. To verify this performance improvement on wafers, an experiment is needed with minimal wafer to wafer and lot to lot variations which can be achieved by reducing time between lots and increasing the number of wafers measured.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Guillaume Schelcher, Marsil Athayde, Stijn Schoofs, Jeff Hsia, Zuan Khalik, Fahong Li, Konstantin Nechaev, Reza Sahraeian, Amir-Hossein Tamaddon, Victor Blanco, Stefan van der Sanden, Yichen Zhang, Roy Anunciado, Harm Dillen, and Philippe Leray "Feature grouping to enable edge placement error-aware process control in multi-feature logic use case", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 129550O (9 April 2024); https://doi.org/10.1117/12.3010421
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KEYWORDS
Semiconducting wafers

Overlay metrology

Cross validation

Logic

Process control

Metrology

Simulations

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