Toward a photonic integrated circuit for a compact hyperspectral imaging system

Sébastien Bourdel; Olivier Gazzano; Maxime Cavillon; Guillaume Druart; Matthieu Lancry

doi:10.1117/12.3017061

18 June 2024 Toward a photonic integrated circuit for a compact hyperspectral imaging system

Sébastien Bourdel, Olivier Gazzano, Maxime Cavillon, Guillaume Druart, Matthieu Lancry

Proceedings Volume 12998, Optics, Photonics, and Digital Technologies for Imaging Applications VIII; 129980U (2024) https://doi.org/10.1117/12.3017061
Event: SPIE Photonics Europe, 2024, Strasbourg, France

Abstract

Photonic Integrated Circuits (PICs) are chips with optical inputs and outputs that are linked by waveguides. They allow for a better control over the light propagation and an improved mechanical stability with respect to free space optical systems. In this article, a three-dimensional photonic integrated circuit (3D PIC) for hyperspectral imaging is proposed. We will also present our latest numerical and experimental results toward the fabrication of a hyperspectral imaging system using 3D PICs fabricated using an ultrafast femtosecond laser in a glass chip.

Conference Presentation

Citation Download Citation

Sébastien Bourdel, Olivier Gazzano, Maxime Cavillon, Guillaume Druart, and Matthieu Lancry "Toward a photonic integrated circuit for a compact hyperspectral imaging system", Proc. SPIE 12998, Optics, Photonics, and Digital Technologies for Imaging Applications VIII, 129980U (18 June 2024); https://doi.org/10.1117/12.3017061

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