Paper
4 August 1993 Process optimization of APEX-E
Author Affiliations +
Abstract
Excimer laser lithography combined with chemically amplified resists offers a viable approach to lithography at 0.5 micrometers and below. APEX-E, a positive tone deep-uv resist used in conjunction with a 0.44 NA excimer laser stepper is capable of 0.35 micrometers resolution. To improve the process window for this resist while reducing the performance variability, the Taguchi method of quality control was employed. The baseline process for APEX-E was characterized, then subsequently used as a comparison to the optimized process as suggested by the Taguchi experiments.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Karen E. Petrillo "Process optimization of APEX-E", Proc. SPIE 1926, Integrated Circuit Metrology, Inspection, and Process Control VII, (4 August 1993); https://doi.org/10.1117/12.148936
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KEYWORDS
Signal to noise ratio

Signal processing

Semiconducting wafers

Lithography

Chemically amplified resists

Polymers

Thin films

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