Silicon wafer board alignment of laser arrays to single-mode optical fiber for analog optoelectronic module applications

Paul O. Haugsjaa; Craig A. Armiento; Andrew J. Negri; Joseph Mehr; Marvin J. Tabasky; Hui Pin Hsu; Willie W. Ng; Daniel Yap; Huan-Wun Yen

doi:10.1117/12.230078

15 January 1996 Silicon wafer board alignment of laser arrays to single-mode optical fiber for analog optoelectronic module applications

Paul O. Haugsjaa, Craig A. Armiento, Andrew J. Negri, Joseph Mehr, Marvin J. Tabasky, Hui Pin Hsu, Willie W. Ng, Daniel Yap, Huan-Wun Yen

Author Affiliations +

Proceedings Volume 2610, Laser Diode Chip and Packaging Technology; (1996) https://doi.org/10.1117/12.230078
Event: Photonics East '95, 1995, Philadelphia, PA, United States

Abstract

This paper describes the development of laser transmitter arrays for analog optoelectronic link applications up to 2 GHz. These modules have been developed in an attempt to utilize passive assembly and alignment operations for the purpose of reducing costs. To this end, silicon waferboard integration platforms and semiconductor laser arrays have been fabricated with special alignment features that allow passive assembly of flip-chip laser arrays to single-mode optical fiber arrays.

Citation Download Citation

Paul O. Haugsjaa, Craig A. Armiento, Andrew J. Negri, Joseph Mehr, Marvin J. Tabasky, Hui Pin Hsu, Willie W. Ng, Daniel Yap, and Huan-Wun Yen "Silicon wafer board alignment of laser arrays to single-mode optical fiber for analog optoelectronic module applications", Proc. SPIE 2610, Laser Diode Chip and Packaging Technology, (15 January 1996); https://doi.org/10.1117/12.230078

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