Applications of Forcefill aluminum for contact and via metallization

Juergen Foerster; Werner K. Robl; Norbert Rausch; Manfred Frank; D. Butler; Paul Rich; J. Marktanner

doi:10.1117/12.324040

4 September 1998 Applications of Forcefill aluminum for contact and via metallization

Juergen Foerster, Werner K. Robl, Norbert Rausch, Manfred Frank, D. Butler, Paul Rich, J. Marktanner

Proceedings Volume 3508, Multilevel Interconnect Technology II; (1998) https://doi.org/10.1117/12.324040
Event: Microelectronic Manufacturing, 1998, Santa Clara, CA, United States

Abstract

The application of Forcefill^®, the high pressure holefill technique for 0.5 micrometer device production is discussed in this paper. For process optimization holefill characteristics are presented as function of Forcefill^® pressure, temperature and process time. Holefill analysis is performed by SEM plan view and cross section. SEM results are correlated to resistance measurements. The productivity of the Forcefill^® process is discussed also. Data are presented showing the very low particle additions achievable with this technique.

Citation Download Citation

Juergen Foerster, Werner K. Robl, Norbert Rausch, Manfred Frank, D. Butler, Paul Rich, and J. Marktanner "Applications of Forcefill aluminum for contact and via metallization", Proc. SPIE 3508, Multilevel Interconnect Technology II, (4 September 1998); https://doi.org/10.1117/12.324040

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