Technological modules for on-chip integration of sensors with electronics

A. Goetz; Carles Cane

doi:10.1117/12.323924

8 September 1998 Technological modules for on-chip integration of sensors with electronics

A. Goetz, Carles Cane

Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323924
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States

Abstract

Technological modules that are needed to fabricate sensors on CMOS wafers are discussed. None of the process steps of the CMOS technology are modified in order to guarantee that the electronics are not affected by the additional sensor process steps. The definition of standardized `add-on' sensor modules to the CMOS process of a foundry is intended to limit the development cost of smart sensors. The application of these modules to the fabrication of a CMOS multisensor chip is described.

Citation Download Citation

A. Goetz and Carles Cane "Technological modules for on-chip integration of sensors with electronics", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); https://doi.org/10.1117/12.323924

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available