Thermal inspection of solder quality of electronic components

Jussi Varis; Reijo K. Lehtiniemi; Reijo Vuohelainen

doi:10.1117/12.342279

19 March 1999 Thermal inspection of solder quality of electronic components

Jussi Varis, Reijo K. Lehtiniemi, Reijo Vuohelainen

Proceedings Volume 3700, Thermosense XXI; (1999) https://doi.org/10.1117/12.342279
Event: AeroSense '99, 1999, Orlando, FL, United States

Abstract

Solder quality of two ball grid array electronic components were studied by using a photothermal inspection technique. In order to introduce artificial defects into the components, columns of soldering joint balls were removed between the electronic component and the printed circuit board. From one of the components, the copper heat slug was also removed to enhance the possibilities for detecting the defects. The components were heated with laser light, and their surface temperatures were monitored with an infrared camera. After heating the component for 1.5 seconds, the defects were resolved, if the plastic covering was removed. In the case of the second component with intact plastic covering, the defects under the component were not resolved. The defects were not visible through the printed circuit board either.

Citation Download Citation

Jussi Varis, Reijo K. Lehtiniemi, and Reijo Vuohelainen "Thermal inspection of solder quality of electronic components", Proc. SPIE 3700, Thermosense XXI, (19 March 1999); https://doi.org/10.1117/12.342279

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