Paper
28 April 1999 Advantages of isofocal printing in maskmaking with the ALTA 3500
Scott E. Fuller, Mike Pochkowski
Author Affiliations +
Proceedings Volume 3741, Lithography for Semiconductor Manufacturing; (1999) https://doi.org/10.1117/12.346876
Event: Microelectronic Manufacturing Technologies, 1999, Edinburgh, United Kingdom
Abstract
The ALTA 3500, an advanced scanned-laser mask lithography tool produced by Etec, was introduced to the marketplace in 1997. The system architecture was described and an initial performance evaluation was presented. This system, based on the ALTA 3000 system, uses a new 33.3X, 0.8 NA final reduction lens to reduce the spot size to 0.27 micrometers FWHM, thereby affording improved resolution and pattern acuity on the mask. An anisotropic chrome etch process was developed and introduced along with a TOK iP3600 resist to take advantage of the improved resolution. In this paper we will more extensively describe the performance of the ALTA 3500 scanned laser system and the performance of these new processes. In addition, an investigation of the benefits of operating in the optimal isofocal print region is examined and compared to printing at the nominal process conditions.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Scott E. Fuller and Mike Pochkowski "Advantages of isofocal printing in maskmaking with the ALTA 3500", Proc. SPIE 3741, Lithography for Semiconductor Manufacturing, (28 April 1999); https://doi.org/10.1117/12.346876
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KEYWORDS
Etching

Photomasks

Printing

Dry etching

Wet etching

Inspection

Critical dimension metrology

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