Additive electroplating technology as a new integration concept for MEMS

Josef Binder; Wolfgang Benecke

doi:10.1117/12.360494

31 August 1999 Additive electroplating technology as a new integration concept for MEMS

Josef Binder, Wolfgang Benecke

Proceedings Volume 3876, Micromachined Devices and Components V; (1999) https://doi.org/10.1117/12.360494
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

This paper reports on a new integration concept for MEMS based on an Additive Electroplating Technology (AET). This technology allows the integration of fixed and movable electroplated microstructure on top of a standard ASIC by a low temperature back-end process. The basic fabrication sequence of the AET including aspects of a first level packaging will be presented. Various examples of novel MEMS for automotive and medical applications will show the capability and the limitations of this integration concept.

Citation Download Citation

Josef Binder and Wolfgang Benecke "Additive electroplating technology as a new integration concept for MEMS", Proc. SPIE 3876, Micromachined Devices and Components V, (31 August 1999); https://doi.org/10.1117/12.360494

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