Grid method for strain measurement in electronic packaging using optical, electronic, and atomic force microscope

Bing Zhao; Anand Krishna Asundi; Kim Eng Oh

doi:10.1117/12.369315

11 November 1999 Grid method for strain measurement in electronic packaging using optical, electronic, and atomic force microscope

Bing Zhao, Anand Krishna Asundi, Kim Eng Oh

Author Affiliations +

Proceedings Volume 3897, Advanced Photonic Sensors and Applications; (1999) https://doi.org/10.1117/12.369315
Event: International Symposium on Photonics and Applications, 1999, Singapore, Singapore

Abstract

The grid method is combined with microscopy for micro deformation measurement. High density grids of 1200 lines/mm are transferred to electronic packaging specimens at high temperature. The residual stress distribution is recorded on the grid after it was cooled to room temperature. The grid pattern is magnified and digitally recorded with optical microscope, scanning electronic microscope, and atomic force microscope respectively. The recorded grid patterns are processed with Fourier transform technique. the spatial resolution degradation due to Fourier transform is discussed. It is found that the upper limit of spatial resolution for displacement measurement is half the grid pitch for grid method. Nevertheless the spatial resolution which can be attained is in micron to sub-micron region even with this degradation. A comparison on the effect of three microscopy techniques is also carried out.

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Bing Zhao, Anand Krishna Asundi, and Kim Eng Oh "Grid method for strain measurement in electronic packaging using optical, electronic, and atomic force microscope", Proc. SPIE 3897, Advanced Photonic Sensors and Applications, (11 November 1999); https://doi.org/10.1117/12.369315

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