Overcritical damped laterally moving microstructures by ADRIE using SOI-substrates for automotive applications

Oliver Krampitz; Michael Wycisk; Volker Biefeld; Josef Binder

doi:10.1117/12.396422

25 August 2000 Overcritical damped laterally moving microstructures by ADRIE using SOI-substrates for automotive applications

Oliver Krampitz, Michael Wycisk, Volker Biefeld, Josef Binder

Author Affiliations +

Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396422
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

A fabrication process for laterally moving single crystal silicon microstructures on SOI substrates is presented. Due to an ADRIE process high aspect ratio structures are realized. The underlying silicon dioxide layer of the SOI substrate serves as sacrificial layer. A HF vapor etching system is used for the sacrificial layer etching to avoid sticking effects of the structures. For the fabrication of an acceleration threshold switch a metallized contact area is necessary. The switching contact is realized using a sidewall metalization of the laterally moving structures. The sensor structure is that of a spring mass system. To avoid uncontrollable switchings of the device, an overcritical damping of the sensor structure is needed. The high aspect ratio of the structures makes these high damping coefficients possible. The dynamic behavior of the device is achieved by squeeze-film damping of the high aspect ratio structures. Using optical measurement equipment for the device characterization, overcritical damping coefficients can be verified for the fabricated structures. The mechanical properties and the dynamic behavior of the structures are ideal for the construction of acceleration threshold switches for automotive applications.

Citation Download Citation

Oliver Krampitz, Michael Wycisk, Volker Biefeld, and Josef Binder "Overcritical damped laterally moving microstructures by ADRIE using SOI-substrates for automotive applications", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396422

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