Positive-tone wafer coating materials evaluation on lithography process

D. F. Huang; Jian-Yuan Chiou; Chih-Chien Hung; B. R. Young

doi:10.1117/12.426818

15 May 2001 Positive-tone wafer coating materials evaluation on lithography process

D. F. Huang, Jian-Yuan Chiou, Chih-Chien Hung, B. R. Young

Proceedings Volume 4277, Integrated Optics Devices V; (2001) https://doi.org/10.1117/12.426818
Event: Symposium on Integrated Optics, 2001, San Jose, CA, United States

Abstract

The polyimide technology has bene used extensively for semiconductor industry, includes buffer coating, interlayer dielectric and passivation, Alpha ray shielding and protective/insulating films. The features of the polyimide material for the new generation of advanced semiconductor products must have excellent properties and high performances to meet various demands in the microelectronics application. The requirements include high resolution, low internal stress, process cost reduction, environment safety, excellent process stability and window in the future. Three kinds of heat-resistant base polymers had been widely applied on wafer-coating processing microelectronic device including polyamic acids, ring-closure type soluble polyimides with hydroxyl groups, and PBO precursors. In this work, we had evaluated positive-tone photosensitivity with aqueous developed polyimide consisting of previous base resins, and compared the difference of process conditions, cured-film properties, adhesion properties, etching recipes as one mask process and reliability test, etc.

Citation Download Citation

D. F. Huang, Jian-Yuan Chiou, Chih-Chien Hung, and B. R. Young "Positive-tone wafer coating materials evaluation on lithography process", Proc. SPIE 4277, Integrated Optics Devices V, (15 May 2001); https://doi.org/10.1117/12.426818

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