Time-resolved measurement of surface displacement in excimer laser ablation of Si

Toshihiko Ooie; Shinsuke Asada; Isamu Miyamoto

doi:10.1117/12.540497

18 November 2003 Time-resolved measurement of surface displacement in excimer laser ablation of Si

Toshihiko Ooie, Shinsuke Asada, Isamu Miyamoto

Proceedings Volume 5063, Fourth International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.540497
Event: Fourth International Symposium on Laser Precision Microfabrication, 2003, Munich, Germany

Abstract

The mechanism for removal of a single-crystal silicon in laser drilling using a KrF excimer laser was investigated. A time-resolved interference analysis was carried out to measure the surface profile of the Si during and after laser irradiation at a laser fluence in the range of 4 - 11 J/cm². The 2nd harmonic output of a Q-switched Nd:YAG laser, the pulse duration of which was 10 ns, was used as the light source of the interferometer. The volume change of Si by melting and thermal expansion was directly observed. The formation and the growth of a sharp projection surrounding the laser-irradiated area was also observed during and after irradiation.

Citation Download Citation

Toshihiko Ooie, Shinsuke Asada, and Isamu Miyamoto "Time-resolved measurement of surface displacement in excimer laser ablation of Si", Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); https://doi.org/10.1117/12.540497

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