Continuum simulation of adhesive-adherend interface layers for USNDE

R. Yerikalapudy Vasudeva; Gopinathan Sudheer

doi:10.1117/12.543241

21 July 2004 Continuum simulation of adhesive-adherend interface layers for USNDE

R. Yerikalapudy Vasudeva, Gopinathan Sudheer

Proceedings Volume 5392, Testing, Reliability, and Application of Micro- and Nano-Material Systems II; (2004) https://doi.org/10.1117/12.543241
Event: NDE for Health Monitoring and Diagnostics, 2004, San Diego, CA, United States

Abstract

Characterization of effective interfacial properties in adhesive joints is one of the major challenges in NDE. The interlayer between the adhesive and the adherend is typically of the order of 1μm and even over this distance -- it is realized -- the interlayer could be a function of depth depending on adhesive penetration and pore formation on adherend surface affecting the ultimate bond strength. The thinness of this complex region is taken advantage of in the present work to treat it as a continuum with different length scales at micro and macro levels. The dispersion-attenuation of leaky guided waves is simulated to facilitate USNDE of this region.

Citation Download Citation

R. Yerikalapudy Vasudeva and Gopinathan Sudheer "Continuum simulation of adhesive-adherend interface layers for USNDE", Proc. SPIE 5392, Testing, Reliability, and Application of Micro- and Nano-Material Systems II, (21 July 2004); https://doi.org/10.1117/12.543241

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