Paper
14 August 2006 Fast and accurate non-contact in situ optical metrology for end-point detection
Author Affiliations +
Abstract
We present design of novel tool for end point detection of wafer thickness, and wafer topography employing low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wojciech J. Walecki, Alexander Pravdivstev, Manuel Santos II, and Ann Koo "Fast and accurate non-contact in situ optical metrology for end-point detection", Proc. SPIE 6292, Interferometry XIII: Techniques and Analysis, 629211 (14 August 2006); https://doi.org/10.1117/12.675342
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Cited by 1 scholarly publication.
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KEYWORDS
Semiconducting wafers

Mirrors

Scanners

Interferometers

Fiber optics

Coherence (optics)

Etching

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