Manufacturing and testing of the line-array fiber optic image slicer based on silicon V-grooves

Jingqiu Liang; Peng Guo; Zhongzhu Liang; Yanqing Zhu; Fengjie Hou; Jinsong Yao

doi:10.1117/12.757832

4 January 2008 Manufacturing and testing of the line-array fiber optic image slicer based on silicon V-grooves

Jingqiu Liang, Peng Guo, Zhongzhu Liang, Yanqing Zhu, Fengjie Hou, Jinsong Yao

Proceedings Volume 6836, MEMS/MOEMS Technologies and Applications III; 683607 (2008) https://doi.org/10.1117/12.757832
Event: Photonics Asia 2007, 2007, Beijing, China

Abstract

Linear fiber-optic image slicer is used more and more in spatial exploration and imaging system. In this paper, a plane arranging method of fiber-optic array based on Si-V grooves is established in order to improve the accuracy and reduce the cost of manufacturing. Firstly, the Si-V groove array is micro-machined with anisotropic etching process, then optical fibers are placed in the grooves orderly with plane arranging method. Secondly, the end surfaces of the device are polished, also the linear fiber-optic image slicer is packaged. Finally, some parameters are tested, including structure parameters, transmittivity and vibration test. Experimental results indicate that the maximum error accumulated in 2000 periods of the Si-V grooves is 0.5μm, the error of the height in Si-V grooves is less than 0.15μm, the roughness of the end surface is less than 0.9nm. The transmittivity of the linear fiber-optic image slicer that without optical film is 51.46% at the wavelength of 632.8nm. After random vibration experiment, the ratio of the broken fiber increased by 0.1%. While the temperature reached 320°C, the stress of epoxy will be 130Mpa, which is close to the limit resistance stress of 139Mpa, some cracks appeared.

Citation Download Citation

Jingqiu Liang, Peng Guo, Zhongzhu Liang, Yanqing Zhu, Fengjie Hou, and Jinsong Yao "Manufacturing and testing of the line-array fiber optic image slicer based on silicon V-grooves", Proc. SPIE 6836, MEMS/MOEMS Technologies and Applications III, 683607 (4 January 2008); https://doi.org/10.1117/12.757832

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