Enhanced pluggable out-of-plane coupling components for printed circuit board-level optical interconnections

J. Van Erps; S. Heyvaert; C. Debaes; B. Van Giel; N. Hendrickx; P. Van Daele; H. Thienpont

doi:10.1117/12.779265

14 May 2008 Enhanced pluggable out-of-plane coupling components for printed circuit board-level optical interconnections

J. Van Erps, S. Heyvaert, C. Debaes, B. Van Giel, N. Hendrickx, P. Van Daele, H. Thienpont

Author Affiliations +

Proceedings Volume 6992, Micro-Optics 2008; 69920S (2008) https://doi.org/10.1117/12.779265
Event: SPIE Photonics Europe, 2008, Strasbourg, France

Abstract

We present an enhanced out-of-plane coupling component for Printed Circuit Board-level optical interconnections. Rather than using a standard 45° micro-mirror to turn the light path over 90° we introduce a curvature in the mirror profile and incorporate an extra cylindrical micro-lens for beam collimation. Both modifications enable an increase in coupling efficiency and are extensively investigated using non-sequential ray tracing simulations in combination with Matlab optimization algorithms. The resulting design is fabricated using Deep Proton Writing and experimental characterization of the geometrical properties and measured coupling efficiencies are presented.

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J. Van Erps, S. Heyvaert, C. Debaes, B. Van Giel, N. Hendrickx, P. Van Daele, and H. Thienpont "Enhanced pluggable out-of-plane coupling components for printed circuit board-level optical interconnections", Proc. SPIE 6992, Micro-Optics 2008, 69920S (14 May 2008); https://doi.org/10.1117/12.779265

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