Fast matching location algorithm based on mixed moment for wire bonding

Fan zhi Kong; Xing zhou Zhang; Yi zhong Wang; Da wei Zhang; Jun lan LI

doi:10.1117/12.807010

2 February 2009 Fast matching location algorithm based on mixed moment for wire bonding

Fan zhi Kong, Xing zhou Zhang, Yi zhong Wang, Da wei Zhang, Jun lan LI

Proceedings Volume 7159, 2008 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications; 71590F (2009) https://doi.org/10.1117/12.807010
Event: International Conference of Optical Instrument and Technology, 2008, Beijing, China

Abstract

Wire bonding is a solid phase welding process, where the two metallic materials (wire and pad surface) are brought into intimate contact. In order to ensure the accuracy and speed of bonding, micro-scoped pattern recognition systems (PRS) are often used to measure the deviation of the actual chip relative to the sampling position (eye-point). In this paper, a new mixed moment feature based matching algorithm is proposed for wire bonding. The important components of Zernike moments and wavelet moments are extracted to compose the mixed moment vector. The realization of location is by calculating the Euclidean distance of mixed moment vectors between the eye-point images and images to be matched. Experimental results show the rotation, translation invariance of the mixed moment features. The algorithm can improve the positioning accuracy while no increase in computational complexity, and can be well used in the precise positioning of the vision system for wire bonding.

Citation Download Citation

Fan zhi Kong, Xing zhou Zhang, Yi zhong Wang, Da wei Zhang, and Jun lan LI "Fast matching location algorithm based on mixed moment for wire bonding", Proc. SPIE 7159, 2008 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications, 71590F (2 February 2009); https://doi.org/10.1117/12.807010

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