Paper
18 March 2009 Assessment of full-chip level EUV optical correction for sub-40nm memory device
Author Affiliations +
Abstract
The two key factors in EUV lithography imaging will be flare and shadow effect among other issues. The flare which is similar to the long range density loading effect and also known to be of high level will generate CD variation throughout the exposure field while the EUV specific shadow effect differentiates H-V CDs along the slit. The long range character of flare in EUV full field scanner can even affect CDs in the neighboring fields. It seems to be apparent that the major imaging challenges for EUV lithography to be successfully adopted and applied to device manufacturing will be determined by how smartly and effectively CD variations induced both by flare and shadow effect in the full chip level are compensated. We investigated and assessed the previously proposed full chip level compensation strategies of the flare and shadow effect in EUVL for the application to memory device both by simulation and experiments on the condition of full field scanner. The effectiveness of flare compensation for the case of thin absorber mask was also addressed together with related impact on the shadow induced H-V CD bias.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jeonghoon Lee, Insung Kim, Doohoon Goo, Joo-on Park, Changmin Park, Jinhong Park, Jeongho Yeo, Seongwoon Choi, and Woosung Han "Assessment of full-chip level EUV optical correction for sub-40nm memory device", Proc. SPIE 7271, Alternative Lithographic Technologies, 727142 (18 March 2009); https://doi.org/10.1117/12.813996
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Cited by 2 scholarly publications.
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KEYWORDS
Extreme ultraviolet lithography

Photomasks

Extreme ultraviolet

Optical proximity correction

Reflectivity

Scanners

Critical dimension metrology

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