Manufacturing, assembling and packaging of miniaturized implants for neural prostheses and brain-machine interfaces

Thomas Stieglitz

doi:10.1117/12.822279

18 May 2009 Manufacturing, assembling and packaging of miniaturized implants for neural prostheses and brain-machine interfaces

Thomas Stieglitz

Author Affiliations +

Proceedings Volume 7362, Smart Sensors, Actuators, and MEMS IV; 73620C (2009) https://doi.org/10.1117/12.822279
Event: SPIE Europe Microtechnologies for the New Millennium, 2009, Dresden, Germany

Abstract

Implantable medical devices to interface with muscles, peripheral nerves, and the brain have been developed for many applications over the last decades. They have been applied in fundamental neuroscientific studies as well as in diagnosis, therapy and rehabilitation in clinical practice. Success stories of these implants have been written with help of precision mechanics manufacturing techniques. Latest cutting edge research approaches to restore vision in blind persons and to develop an interface with the human brain as motor control interface, however, need more complex systems and larger scales of integration and higher degrees of miniaturization. Microsystems engineering offers adequate tools, methods, and materials but so far, no MEMS based active medical device has been transferred into clinical practice. Silicone rubber, polyimide, parylene as flexible materials and silicon and alumina (aluminum dioxide ceramics) as substrates and insulation or packaging materials, respectively, and precious metals as electrodes have to be combined to systems that do not harm the biological target structure and have to work reliably in a wet environment with ions and proteins. Here, different design, manufacturing and packaging paradigms will be presented and strengths and drawbacks will be discussed in close relation to the envisioned biological and medical applications.

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Thomas Stieglitz "Manufacturing, assembling and packaging of miniaturized implants for neural prostheses and brain-machine interfaces", Proc. SPIE 7362, Smart Sensors, Actuators, and MEMS IV, 73620C (18 May 2009); https://doi.org/10.1117/12.822279

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