CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 7585 > Article
Paper
23 February 2010 Integration of electronics and photonics in active material by femtosecond laser for functional microdevice fabrication
Ya Cheng, Zhizhan Xu, Koji Sugioka, Katsumi Midorikawa
Author Affiliations +
Proceedings Volume 7585, Laser-based Micro- and Nanopackaging and Assembly IV; 75850D (2010) https://doi.org/10.1117/12.838655
Event: SPIE LASE, 2010, San Francisco, California, United States
Abstract
Recently, hybrid integration of multifunctional micro-components for creating complex, intelligent micro/nano systems has attracted significant attention. These micro/nano systems have important applications in a variety of areas, such as healthcare, environment, communication, national security, and so on. Until now, fabrication of micro/nano systems incorporated with different functions is still a challenging issue, which generally requires fabrication of microcomponents beforehand followed by assembly and packaging procedures. Thus, the fabrication process is complex and costly. In recent years, the rapid development of femtosecond laser microfabrication technology has enabled direct fabrication and integration of multifunctional components, such as microfluidics, microoptics, micromechanics, microelectronics, etc., into a substrate. Particularly, in this talk, we show the use of femtosecond laser microfabrication for integrating microelectronics and microphotonics. Both microelectrodes and optical waveguides can be directly embedded in active materials after a femtosecond laser direct writing followed by electroless chemical plating. As examples, electric-optic (EO) modulators were fabricated in lithium niobate (LiNbO3) crystal and their functions were demonstrated.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Ya Cheng, Zhizhan Xu, Koji Sugioka, and Katsumi Midorikawa "Integration of electronics and photonics in active material by femtosecond laser for functional microdevice fabrication", Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 75850D (23 February 2010); https://doi.org/10.1117/12.838655
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
;
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 15 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Femtosecond phenomena
Copper
Silver
Glasses
Waveguides
Electroless plating
Electrodes
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top