Continuous evolution of lithographic films through process steps: an example with 193 chemically amplified resists

Samir Derrough; Raluca Tiron; Damien Perret; James W. Thackeray; Claire Sourd; Patrick Paniez

doi:10.1117/12.846087

25 March 2010 Continuous evolution of lithographic films through process steps: an example with 193 chemically amplified resists

Samir Derrough, Raluca Tiron, Damien Perret, James W. Thackeray, Claire Sourd, Patrick Paniez

Author Affiliations +

Proceedings Volume 7639, Advances in Resist Materials and Processing Technology XXVII; 763937 (2010) https://doi.org/10.1117/12.846087
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

Chemically Amplified resists are complex systems. If the main mechanisms implied have already been described, the challenge to even better control and model these formulations remains important as performance requirements become more and more stringent and critical dimensions get smaller and smaller. This paper tries to assess and deconvolute some of the main potential mechanisms involved during the process of a 193 nm chemically amplified resist, before correlating them with the final lithographic results obtained. A formulation was selected in order to offer a large range of film physical properties, thus allowing the resist film to switch from non-annealing to annealing conditions. The use of thermal analysis as the main characterization technique allowed correlation between the variations in physico-chemical properties and process conditions. This investigation also included a study of the behavior of some additives during bake steps. In so doing, it became possible to correlate the variations of the resist properties under different bake conditions to the changes in its final lithographic performance, i.e. contrast, sensitivity and line edge roughness.

Citation Download Citation

Samir Derrough, Raluca Tiron, Damien Perret, James W. Thackeray, Claire Sourd, and Patrick Paniez "Continuous evolution of lithographic films through process steps: an example with 193 chemically amplified resists", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763937 (25 March 2010); https://doi.org/10.1117/12.846087

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available