Thermal effects on interconnect crosstalk of optoelectronic transmitter modules

Ikechi Augustine Ukaegbu; Jamshid Sangirov; Bikash Nakarmi; Tae-Woo Lee; Mu-Hee Cho; Hyo-Hoon Park

doi:10.1117/12.999876

27 November 2012 Thermal effects on interconnect crosstalk of optoelectronic transmitter modules

Ikechi Augustine Ukaegbu, Jamshid Sangirov, Bikash Nakarmi, Tae-Woo Lee, Mu-Hee Cho, Hyo-Hoon Park

Proceedings Volume 8555, Optoelectronic Devices and Integration IV; 85551Y (2012) https://doi.org/10.1117/12.999876
Event: Photonics Asia, 2012, Beijing, China

Abstract

An analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is accurate for computing crosstalk of interconnects used in chip packaging. In addition, model is used to determine the thermal critical frequency, f_crit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic transmitter modules for reliable data transmission.

Citation Download Citation

Ikechi Augustine Ukaegbu, Jamshid Sangirov, Bikash Nakarmi, Tae-Woo Lee, Mu-Hee Cho, and Hyo-Hoon Park "Thermal effects on interconnect crosstalk of optoelectronic transmitter modules", Proc. SPIE 8555, Optoelectronic Devices and Integration IV, 85551Y (27 November 2012); https://doi.org/10.1117/12.999876

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