Fabrication and electrical characterization of Pd/TiO2/n-Si MIS structure using TiO2 film as insulator layer deposited by low temperature arc vapor deposition process

Kumar Shubham; R. U. Khan; P. Chakrabarti

doi:10.1117/12.2009612

28 January 2013 Fabrication and electrical characterization of Pd/TiO₂/n-Si MIS structure using TiO₂ film as insulator layer deposited by low temperature arc vapor deposition process

Kumar Shubham, R. U. Khan, P. Chakrabarti

Author Affiliations +

Proceedings Volume 8760, International Conference on Communication and Electronics System Design; 876007 (2013) https://doi.org/10.1117/12.2009612
Event: International Conference on Communication and Electronics System Design, 2013, Jaipur, India

Abstract

Fabrication and electrical characterization of a Pd/TiO₂/n-Si MIS structure have been reported in this paper. The TiO₂ layer has been deposited on n-Si by using low temperature arc vapor deposition (LTAVD) technique. The currentvoltage and capacitance-voltage characteristics were studied at room temperature (300 K) for sample devices with TiO₂ film annealed at different temperatures (450 to 550°C). The study reveals that the capacitance in the accumulation region has frequency dispersion at high frequencies which is attributed to leakage behavior of TiO₂ insulating layer, interface states and oxide defects. As-deposited film exhibits high level of interface states resulting in high leakage current density which can be reduced by an order of magnitude by post-deposition annealing. Different models of current conduction mechanism have been applied to study the measured data. It is found that Schottky–Richardson (SR) emission model is applicable at low bias voltage, Frenkel-Poole (FP) emission model at moderate bias voltages while Fowler–Nordheim (FN) tunneling dominates at higher bias voltages.

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Kumar Shubham, R. U. Khan, and P. Chakrabarti "Fabrication and electrical characterization of Pd/TiO₂/n-Si MIS structure using TiO₂ film as insulator layer deposited by low temperature arc vapor deposition process", Proc. SPIE 8760, International Conference on Communication and Electronics System Design, 876007 (28 January 2013); https://doi.org/10.1117/12.2009612

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