Paper
30 September 2013 Evaluation of optical and chromatic properties under electrical and thermal coupling in solid state lighting systems
Han-Kuei Fu, Yi-Ping Peng, Chien-Ping Wang, Hsin-Chien Chiang, Tzung-Te Chen, Chiu-Ling Chen, Pei-Ting Chou
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Abstract
For energy-saving, high efficiency and low pollution, the lighting of LED systems is important for the future of green energy technology industry. The solid state lighting becomes the replacement of traditional lighting, such as, light bulbs and compact fluorescent lamps. Because of the semiconductor characteristics, the luminous efficiency of LEDs is sensitive to the operating temperature. Besides increasing the luminous efficiency, effective controlling electricity and thermal characteristics in the design of LED lighting products is the key point to achieve the best results. LED modules can be combined with multi-grain process or through a combination of multiple LED chips. Accurate analysis of this LED module for the electrical, thermal characteristics and high reliability is the critical knowledge of modular design. In this report, we studied the electrical and thermal coupling phenomenon in solid state lighting systems to analyze their reliability. By experiments and simulations, we obtained the apparent variation of temperature distribution of LED system due to differences of their forward voltages and thermal resistances. These events may reduce their reliability. Besides, the evaluation of optical and chromatic properties was based on the variation of temperature distribution and current of LED system. This is the key technology to predict the optical and chromatic properties of LED system in use.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Han-Kuei Fu, Yi-Ping Peng, Chien-Ping Wang, Hsin-Chien Chiang, Tzung-Te Chen, Chiu-Ling Chen, and Pei-Ting Chou "Evaluation of optical and chromatic properties under electrical and thermal coupling in solid state lighting systems", Proc. SPIE 8835, LED-based Illumination Systems, 88350Y (30 September 2013); https://doi.org/10.1117/12.2025366
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KEYWORDS
Light emitting diodes

Resistance

Temperature metrology

LED lighting

Thermography

Colorimetry

Reliability

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