Organized by Photomask Japan SPIE Co-organized by BACUS EMLC In Cooperation with The Japan Society of Applied Physics The Japan Society for Precision Engineering The Institute of Electrical Engineering (Japan) Technical Exhibit in Cooperation with SEMI (Japan) Supported by City of Yokohama Published by SPIE Volume 9658 Proceedings of SPIE 0277-786X, V. 9658 SPIE is an international society advancing an interdisciplinary approach to the science and application of light. The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon. Please use the following format to cite material from this book: Author(s), “Title of Paper,” in Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII, edited by Nobuyuki Yoshioka, Proceedings of SPIE Vol. 9658 (SPIE, Bellingham, WA, 2015) Article CID Number. ISSN: 0277-786X ISBN: 9781628418712 Published by SPIE P.O. Box 10, Bellingham, Washington 98227-0010 USA Telephone +1 360 676 3290 (Pacific Time) · Fax +1 360 647 1445 SPIE.org Copyright © 2015, Society of Photo-Optical Instrumentation Engineers. Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of copying fees. The Transactional Reporting Service base fee for this volume is $18.00 per article (or portion thereof), which should be paid directly to the Copyright Clearance Center (CCC), 222 Rosewood Drive, Danvers, MA 01923. Payment may also be made electronically through CCC Online at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher. The CCC fee code is 0277-786X/15/$18.00. Printed in the United States of America. Publication of record for individual papers is online in the SPIE Digital Library.
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Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc. Adachi, Takashi, 0P Ahn, Won-suk, 08 Akima, Shinji, 0G Amano, Tsuyoshi, 0L, 0M Anze, Hirohito, 0R Arai, Goki, 1A, 1B Arias Espinoza, Juan Diego, 0J Axelrad, Valery, 0A Badger, Karen, 0G Bang, Ju-Mi, 08 Barouch, Eytan, 0K, 13 Bekaert, J., 04 Bender, Markus, 12 Benk, Markus P., 0E Bhamidipati, Samir, 0X Bogers, Maurice, 0J Bolton, Luke, 11 Bonam, Ravi, 0G, 11 Brouns, Derk, 0J Buck, Peter, 0X Cao, Y., 04 Chalom, Daniel, 05 Cheong, Lin, 11 Choi, Jin, 0C Collins, Kevin, 11 Daneshpanah, Mehdi, 05 Davydova, Natalia, 0I de Kruif, Robert, 0I de Winter, Laurens, 0J Deng, Erwin, 0Y Dhalluin, Florian, 0J Dinh, Thanh-Hung, 1A, 1B Doise, J., 04 Eder-Kapl, Stefan, 05 Eyring, Stefan, 05 Fenger, G., 04 Fliervoet, Timon, 0I Fujii, Nobuaki, 0V Fujimura, Yukihiro, 0P Fujino, Takahiro, 18 Fujiyoshi, Ryoko, 1C Fukugami, Norihito, 0H Gallagher, Emily, 0F, 0H Ganjugunte, Shashidhara K., 10 Garbowski, Tomasz, 07 Garetto, Anthony, 0U Geist, David, 05 Goldberg, Kenneth A., 0E Gronheid, R., 04 Guo, Eric, 0S Hara, Daisuke, 0V Hara, Hiroyuki, 1A, 1B Harada, Tetsuo, 18, 19 Hashimoto, Hiraku, 19 Hatakeyama, Masahiro, 0L Hatayama, Masatoshi, 14 Hayano, Katsuya, 0P, 0V Hendrickx, Eric, 0I Her, Y. J., 04 Higashiguchi, Takeshi, 1A, 1B Hirano, Ryoichi, 0L, 0M Hirano, Termusa, 03 Horiuchi, Toshiyuki, 15, 16, 17 Hosono, Koji, 0Z Hudek, Peter, 05 Ichimaru, Satoshi, 14 Iguchi, Haruki, 19 Iida, Susumu, 0L, 0M Iizuka, Tetsuya, 02 Imai, Hidemichi, 0V Ino, Tomohisa, 0N Ishii, Hiroyuki, 0A Isogawa, Takeshi, 0G, 11 Iwanaga, Yoshinori, 03 Iwasaki, Jun-ya, 17 Jayaram, Srividya, 10 Jeon, Chan-Uk, 08, 0C Ji, Hye-Rim, 13 Jonckheere, Rik, 0F, 0H Jung, HoYong, 06 Kagawa, Masayuki, 0G, 11 Kamikubo, Takashi, 0R Kanaya, Yasuhiro, 02 Kanno, Koichi, 0V, 0W Kato, Yasuo, 0R Kemen, Thomas, 07 Kemmochi, Daisuke, 03 Kim, ByungJu, 0Q Kim, Guk-Jin, 13 Kim, Hee-Bom, 08 Kim, In-Seon, 0K, 13 Kim, Ji-Young, 08 Kim, Min-Su, 13 Kim, MunSik, 06 Kim, SangPyo, 06, 0Q Kindt, Louis, 11 Kinoshita, Hiroo, 18, 19 Kinoshita, Hiroshi, 03 Klikovits, Jan, 05 Kodera, Yutaka, 0G, 0H Kozawa, Takahiro, 1C Kuki, Masaki, 19 Kuribara, Masayuki, 0V Kusunose, Haruhiko, 0O LaCour, Pat, 10 Laske, Frank, 05 Lawliss, Mark, 0G, 11 Lee, Dong Hyun, 0C Lee, Rachel, 0Y Lee, SookHyun, 0C Lentzen, Sven, 0J Li, Rivan, 0S Lim, JongHoon, 0Q Lin, Roger, 0Y Lin, Shaina, 0Y Lu, Max, 0S Mangat, Pawitter, 0E Matsumoto, Hiroyuki, 0Z Matsumoto, Jun, 0V Matsushita, Shohei, 0V Mikami, Koji, 0A Miura, Yoichi, 0P Miyai, Hiroki, 0N, 0O Miyajima, Masaaki, 0Z Miyashita, Hiroyuki, 0P, 0V, 0W Miyauchi, Toru, 0Z Miyazaki, Junji, 0I Mori, Ichiro, 0O Morikawa, Yasutaka, 0P Morizane, Yuta, 16 Murakami, Takeshi, 0L Murakawa, Tsutomu, 0V Nagata, Yutaka, 18 Nakagawa, Takashi, 0T Nakajima, Fumitaka, 0T Nakamura, Takayuki, 0V Nakayama, Ryo, 0A Nakayamada, Noriaki, 0R Namkung, Hoon, 06 Naoe, Mitsufumi, 0Z Narita, Eisuke, 11 Nesládek, Pavel, 12 Neumann, Jens Timo, 0I Nishiguchi, Masaharu, 0W Nishimoto, Nirou, 0T Nomura, Haruyuki, 0R Nomura, Naoya, 1C Ogasawara, Munehiro, 0R Oh, Hye-Keun, 0K, 13 Ohara, Kana, 0W Ohchi, Tadayuki, 14 Ohta, Eiji, 0T Okamoto, Kazumasa, 1C Oku, Satoshi, 14 Oyama, Kenichi, 0A Pang, Linyong, 0V Paninjath, Sankaranarayanan, 0X Park, EuiSang, 06, 0Q Park, Jin-Goo, 13 Park, Sinjeung, 0C Pereira, Mark, 0X Péter, Mária, 0J Philipsen, Vicky, 0I Poro, Richard, 11 Qi, Zhengqing John, 0G Rademacher, Thomas, 0U Rankin, Jed, 0G, 11 Roeth, Klaus-Dieter, 05 Rolff, Haiko, 12 Ruinemans, Erik, 0J Ryckaert, J., 04 Sakajiri, Kyohei, 0B Sakata, Yo, 0H Satake, Masaki, 0W Sato, Takanori, 15 Scaccabarozzi, Luigi, 0J Schedel, Thorsten, 12 Schulz, Kristian, 0U Seki, Kazunori, 0G Seo, Hwan-Seok, 08 Seung, Byoung-Hoon, 08 Shi, Irene, 0S Shida, Soichi, 0V Shin, In Kyun, 0C Smayling, Michael C., 0A Smith, Daniel, 0J Son, Donghwan, 0W Son, JaeSik, 0Q Song, Jae-Min, 08 Steinhartová, Tereza, 12 Strecker, Norbert, 10 Suematsu, Kenichi, 0L Suganuma, Mizuna, 0R Sunahara, Atsushi, 1A, 1B Suzuki, Tomohiro, 0O Tachikawa, Masahiro, 0T Takagi, Noriaki, 0F Takeda, Nobuo, 0T Takehisa, Kiwamu, 0O Takeuchi, Kanji, 0Z Tamamushi, Shuichi, 0C Tanaka, Yusuke, 18 Tani, Ayako, 0P Terao, Kenji, 0L Tian, Eric, 0S Tolani, Vikram, 0W Tomooka, Takatoshi, 02 Torunoglu, Ilhami, 10 Tsujita, Koichiro, 0A Turley, Christina, 11 Umegaki, Kikuo, 1C Van den Heuvel, Dieter, 0F Van der Sanden, Jack, 0J Van der Zande, Wim, 0J Van Gils, Rob, 0J Van Look, Lieve, 0I van Oosten, Anton, 0I van Schoot, Jan, 0I Vandenberghe, Geert, 04, 0I Verduijn, Erik, 0E, 0H Vermeulen, Hans, 0J Wang, Alice, 0Y Watanabe, Genta, 0H Watanabe, Hidehiro, 0F, 0L, 0M, 0O Watanabe, Jun, 17 Watanabe, Takeo, 18, 19 Wittebrood, Friso, 0I Wojdyla, Antoine, 0E Wood, Obert R., II, 0E Yaegashi, Hidetami, 0A Yamamoto, Hiroki, 1C Yamane, Takeshi, 0N Yang, Chuen Huei, 0Y Yashima, Jun, 0R Yeung, Micheal, 0K, 13 Yim, DongGyu, 06, 0Q Yoshikawa, Shingo, 0P, 0V Yoshikawa, Shoji, 0L Yoshikawa, Yutaka, 03 Zeidler, Dirk, 07
Conference CommitteesSymposium Chair Symposium Vice Chair Advisory Committee Chair Advisory Committee Morihisa Hoga, Dai Nippon Printing Company, Ltd. (Japan) Masao Otaki, Toppan Printing Company, Ltd. (Japan) Tadahiro Takigawa, ALITECS Corporation (Japan) Yoshio Tanaka, D2S K.K. (Japan)
Organizing Committee Chair Organizing Committee Vice Chair Organizing Committee Uwe Behringer, UBC Microelectronics (Germany) Parkson Chen, Taiwan Mask Corporation (Taiwan) Junko Collins, SEMI Japan (Japan) Brian J. Grenon, RAVE, LLC (United States) Takehiko Gunji, Sony Semiconductor Corporation (Japan) Hideaki Hamada, HTL Company Japan Ltd. (Japan) Naoya Hayashi, Dai Nippon Printing Company, Ltd. (Japan) Eiichi Hoshino, Nikon Corporation (Japan) Kunihiro Hosono, Renesas System Design Company, Ltd. (Japan) Hideaki Mitsui, HOYA Corporation (Japan) Junji Miyazaki, ASML Japan Company, Ltd. (Japan) Warren Montgomery, Colleges of Nanoscale Science and Engineering (United States) Ichiro Mori, EUVL Infrustructure Development Center, Inc. (Japan) Koichiro Tsujita, Canon Inc. (Japan) Anto Yasaka, Hitachi High-Tech Science Corporation (Japan) Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan)
Auditors Yoshiki Suzuki, KLA-Tencor Japan Ltd. (Japan) Yoji Tonooka, Toppan Printing Company, Ltd. (Japan)
Steering Committee Chair Steering Committee Vice Chairs Toshio Konishi, Toppan Printing Company, Ltd. (Japan) Hidehiro Watanabe, EUVL Infrustructure Development Center, Inc. (Japan)
Steering Committee Takayuki Abe, NuFlare Technology Inc. (Japan) Akihiko Ando, Renesas System Design Company, Ltd. (Japan) Takashi Kamo, Toshiba Corporation Semiconductor & Storage Products Company (Japan) Kokoro Kato, Hitachi High-Tech Science Corporation (Japan) Yasutaka Morikawa, Dai Nippon Printing Company, Ltd. (Japan) Hiroaki Morimoto, Toppan Printing Company, Ltd. (Japan) Teruaki Noguchi, JEOL Ltd. (Japan) Yasushi Okubo, HOYA Corporation (Japan) Tomoyuki Okada, FUJITSU Semiconductor Ltd. (Japan) Kiwamu Takehisa, Lasertec Corporation (Japan) Hiroyoshi Tanabe, Intel K.K. (Japan) Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan)
Program Committee Chair Program Committee Vice Chairs Akihiko Ando, Renesas System Design Company, Ltd. (Japan) Kiwamu Takehisa, Lasertec Corporation (Japan)
Program Committee Tsukasa Abe, Dai Nippon Printing Company, Ltd. (Japan) Peter Buck, Mentor Graphics Corporation (United States) Jeff Farnsworth, Intel Corporation Technology & Manufacturing Group (United States) Thomas B. Faure, IBM Corporation (United States) Kazuyuki Hagiwara, D2S, K.K. (Japan) Shigeru Hirukawa, Nikon Corporation (Japan) Koji Hosono, FUJITSU Semiconductor Ltd. (Japan) Hidemichi Imai, Dai Nippon Printing Company, Ltd. (Japan) Ichiro Kagami, Sony Semiconductor Corporation (Japan) Franklin Kalk, Toppan Photomasks Inc. (United States) Takashi Kamikubo, NuFlare Technology, Inc. (Japan) Kokoro Kato, Hitachi High-Tech Science Corporation (Japan) Byung-Gook Kim, Samsung Electronics Company, Ltd. (Republic of Korea) Yutaka Kodera, Toppan Printing Company, Ltd. (Japan) Jun Kotani, Toppan Printing Company, Ltd. (Japan) John Lin, Taiwan Semiconductor Manufacturing Company (Taiwan) Mark Ma, Photronics, Inc. (United States) Junji Miyazaki, ASML Japan Company, Ltd. (Japan) Koji Murano, TOSHIBA Corporation Semiconductor & Storage Products Company (Japan) Yoshinori Nagaoka, KLA-Tencor Japan Ltd. (Japan) Yasutoshi Nakagawa, JEOL Ltd. (Japan) Naoki Nishida, HOYA Corporation (Japan) Yasunari Sohda, Hitachi, Ltd. (Japan) Osamu Suga, EUVL Infrastructure Development Center, Inc. (Japan) Yasuko Tabata, TowerJazz Panasonic Semiconductor Company, Ltd. (Japan) Yoichi Usui, HOYA Corporation (Japan) Nobuhiko Yabu, Canon Inc. (Japan) Tetsuya Yamamoto, KLA-Tencor Corporation (United States)
Session Chairs 1 FPD Photomasks Ichiro Kagami, Sony Semiconductor Corporation (Japan) Nobuhiko Yabu, Canon Inc. (Japan) 2 Keynote Lecture Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan) 3 DSA Akihiko Ando, Renesas System Design Company, Ltd. (Japan) Jo Finders, ASML (The Netherlands) 4 Writing Technologies Takashi Kamikubo, NuFlare Technology, Inc. (Japan) Uwe Behringer, UBC Microelectronics (Germany) 5 Photomask Fabrication Processes Jun Kotani, Toppan Printing Company, Ltd. (Japan) Frank E. Abboud, Intel Corporation (United States) 6 MDP & OPC Kokoro Kato, Hitachi High-Tech Science Corporation (Japan) Peter Buck, Mentor Graphics Corporation (United States) 8 EUVL Masks I Yutaka Kodera, Toppan Printing Company, Ltd. (Japan) Hidemichi Imai, Dai Nippon Printing Company, Ltd. (Japan) 9 EUVL Masks II Tsukasa Abe, Dai Nippon Printing Company, Ltd. (Japan) Takashi Kamo, Toshiba Corporation Semiconductor & Storage Products Company (Japan) 10 EUVL Masks III Masashi Sunako, Lasertec USA, Inc. (United States) Thomas B. Faure, IBM Corporation (United States) 11 EUVL Masks IV Koji Murano, TOSHIBA Corporation Semiconductor & Storage Products Company (Japan) Pavel Nesladek, AMTC Dresden (Germany)
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