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Pixel pitch size reduction was not the focus in early infrared (IR) detector development for a long time with pixel pitch remained at 24 μm or above. Pitch size reduction today is the key enabler for cost-efficient manufacturing of large format arrays and allows compact IR-systems with high spatial resolution. When mastered the smaller pixel pitch geometries will provide consistent range performance in a smaller package, minimized aliasing and false alarm rates, ability to use faster F/# optics and shorter focal length for long range identification and optimized size, weight and power (SWaP) characteristics. Advanced integration technologies (including three-dimensional integration) are necessary to realize small pitch arrays.
EPIR, Inc. has developed thermomechanical stress aware approach for advanced integration of IR focal plane arrays (IRFPAs) – MoDiBI. As intended, MoDiBI allows for favorably addressing the reliability concerns associated with the conventional integration approaches. The current work focuses on extending MoDiBI to small pixel pitch, large format IRFPA integration. Strategies for optimizing the thermal stress induced in the hybridized assembly during thermal cycling, thereby helping in reducing the fatal failures experienced by IRFPAs will be discussed. Applicability of MoDiBI to 1280×720, 8µm pitch IRFPAs will be presented.
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