Patterning critical dimension control for advanced logic nodes

Bertrand Le-Gratiet; Jean De-Caunes; Maxime Gatefait; Auguste Lam; Alain Ostrovsky; Jonathan Planchot; Vincent Farys; Julien Ducoté; Marc Mikolajczak; Vincent Morin; Nicolas Chojnowski; Frank Sundermann; Alice Pelletier; Regis Bouyssou; Cedric Monget; Jean-Damien Chapon; Bastien Orlando; Laurene Babaud; Céline Lapeyre; Emek Yesilada; Anna Szucs; Jean-Christophe Michel; Latifa Desvoivres; Onintza Ros Bengoechea; Pascal Gouraud

doi:10.1117/1.JMM.14.2.021103

10 April 2015 Patterning critical dimension control for advanced logic nodes

Bertrand Le-Gratiet, Jean De-Caunes, Maxime Gatefait, Auguste Lam, Alain Ostrovsky, Jonathan Planchot, Vincent Farys, Julien Ducoté, Marc Mikolajczak, Vincent Morin, Nicolas Chojnowski, Frank Sundermann, Alice Pelletier, Regis Bouyssou, Cedric Monget, Jean-Damien Chapon, Bastien Orlando, Laurene Babaud, Céline Lapeyre, Emek Yesilada, Anna Szucs, Jean-Christophe Michel, Latifa Desvoivres, Onintza Ros Bengoechea, Pascal Gouraud

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 14, Issue 2, 021103 (April 2015). https://doi.org/10.1117/1.JMM.14.2.021103

Abstract

Patterning process control has undergone major evolutions over the last few years. Critical dimension, focus, and overlay control require deep insight into process-variability understanding to be properly apprehended. Process setup is a complex engineering challenge. In the era of mid k1 lithography (<0.6), process windows were quite comfortable with respect to tool capabilities, therefore, some sources of variability were, if not ignored, at least considered as negligible. The low k1 patterning (<0.4) era has broken down this concept. For the most advanced nodes, engineers need to consider such a wide set of information that holistic processing is often mentioned as the way to handle the setup of the process and its variability. The main difficulty is to break down process-variability sources in detail and be aware that what could have been formerly negligible has become a very significant contributor requiring control down to a fraction of a nanometer. The scope of this article is to highlight that today, engineers have to zoom deeper into variability. Even though process tools have greatly improved their capabilities, diminishing process windows require more than tool-intrinsic optimization. Process control and variability compensations are major contributors to success. Some examples will be used to explain how complex the situation is and how interlinked processes are today.

Citation Download Citation

Bertrand Le-Gratiet, Jean De-Caunes, Maxime Gatefait, Auguste Lam, Alain Ostrovsky, Jonathan Planchot, Vincent Farys, Julien Ducoté, Marc Mikolajczak, Vincent Morin, Nicolas Chojnowski, Frank Sundermann, Alice Pelletier, Regis Bouyssou, Cedric Monget, Jean-Damien Chapon, Bastien Orlando, Laurene Babaud, Céline Lapeyre, Emek Yesilada, Anna Szucs, Jean-Christophe Michel, Latifa Desvoivres, Onintza Ros Bengoechea, and Pascal Gouraud "Patterning critical dimension control for advanced logic nodes," Journal of Micro/Nanolithography, MEMS, and MOEMS 14(2), 021103 (10 April 2015). https://doi.org/10.1117/1.JMM.14.2.021103

Published: 10 April 2015

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available