Mr. Axel von Sydow Profile

Axel von Sydow

at ASML Netherlands BV

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Publications (3)

Proceedings Article | 22 February 2021 Presentation

Extending DUV productivity and overlay through joint dry and immersion scanner advancements

Bart Paarhuis, Wim de Boeij, Aditya Deshpande, Axel von Sydow, Hoite Tolsma, Martijn Houben, Geert Hofmans

Proceedings Volume 11613, 116130L (2021) https://doi.org/10.1117/12.2584494

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In this paper we present the key enhancements incorporated in the new NXT platform and also share future development steps enabled by the platform. These innovations build on driving the system productivity while in parallel improving the overlay performance and at the same time minimizing the scanner grid differences between NXT-based ArF/ArFi/KrF and NXE-based EUV scanners. Both hardware as well as software improvements play an important role in improving cross-matching overlay performance. On the hardware side, changes have been introduced to key modules such as the projection lens and the reticle stage to better match to EUV layers. Furthermore, the new NXT platform introduces a more powerful wafer stage to support better overlay accuracy as well as improved productivity. Complementary software-based corrections are developed to further correct for grid imperfections. For instance to reduce the impact of DUV pellicle distortions, onscanner real-time corrections have been added to the scanner metrology control architecture. ‘Maximizing the number of good-wafers-per-day’ has been the guiding principle for the development of the new NXT platform. Apart from driving the scanner productivity along the traditional wafer-per-hour metric, advancements have been implemented to improve the operational efficiency of the scanner on production use-cases while also minimizing the time spent on required system maintenance. This all to maximize the effective scanner output under HVM conditions. The new NXT platform is currently being rolled out for the most advanced immersion and ArF scanners – the NXT:2050i and the NXT:1470. Going forward, it will support further productivity steps and improved overlay accuracy and EUV matching developments. The platform is also prepared to support KrF scanners in the near future, where especially the productivity will be stretched for this wavelength. Longer term this platform will serve as the stepping stone towards significantly higher wafers-per-day productivity levels and sub-nm overlay accuracy.

Proceedings Article | 11 April 2017 Presentation + Paper

Process margin improvement through finger-print removal based on scanner leveling data

Young Jun Kim, Tony Park, Jeong Heung Kong, Dong Kyung Han, Jin Phil Choi, Young Seog Kang, Se Yeon Jang, Jeroen Cottaar, Jan-Pieter van Delft, Jeroen Rutten, Axel von Sydow, Marcel Bontekoe, Maarten Boogaarts, Arjan Donkerbroek, Ruiyue Ouyang, Balaji Rangarajan, Khalid Elbattay, Andrew Moe, Chung-Yong Kim

Proceedings Volume 10147, 1014709 (2017) https://doi.org/10.1117/12.2258184

KEYWORDS: Manufacturing

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Proceedings Article | 30 June 2012 Paper

Past and future challenges from a display mask writer perspective

Peter Ekberg, Axel von Sydow

Proceedings Volume 8441, 84410N (2012) https://doi.org/10.1117/12.970249

KEYWORDS: Photomasks, LCDs, Glasses, Manufacturing, Image quality, Eye, CRTs, Sensors, Metrology, Image processing

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Since its breakthrough, the liquid crystal technology has continued to gain momentum and the LCD is today the dominating display type used in desktop monitors, television sets, mobile phones as well as other mobile devices. To improve production efficiency and enable larger screen sizes, the LCD industry has step by step increased the size of the mother glass used in the LCD manufacturing process. Initially the mother glass was only around 0.1 m² large, but with each generation the size has increased and with generation 10 the area reaches close to 10 m². The increase in mother glass size has in turn led to an increase in the size of the photomasks used - currently the largest masks are around 1.6 × 1.8 meters. A key mask performance criterion is the absence of "mura" - small systematic errors captured only by the very sensitive human eye. To eliminate such systematic errors, special techniques have been developed by Micronic Mydata. Some mura suppressing techniques are described in this paper. Today, the race towards larger glass sizes has come to a halt and a new race - towards higher resolution and better image quality - is ongoing. The display mask is therefore going through a change that resembles what the semiconductor mask went through some time ago: OPC features are introduced, CD requirements are increasing sharply and multi tone masks (MTMs) are widely used. Supporting this development, Micronic Mydata has introduced a number of compensation methods in the writer, such as Z-correction, CD map and distortion control. In addition, Micronic Mydata MMS15000, the world's most precise large area metrology tool, has played an important role in improving mask placement quality and is briefly described in this paper. Furthermore, proposed specifications and system architecture concept for a new generation mask writers - able to fulfill future image quality requirements - is presented in this paper. This new system would use an AOD/AOM writing engine and be capable of resolving 0.6 micron features.

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