In the past decades, terahertz (THz) large area emitters (LAEs) have been used for broadband THz generation. To achieve broadband operation, the ultrafast photoconductor of THz LAE is mainly based on III-V semiconductor materials, which is designed to offer decent quantum efficiency, high carrier mobility, and low carrier lifetime simultaneously. However, the sophisticated epitaxial process constrains the application scopes of conventional THz LAEs. Here, we present a cost-effective, CMOS-compatible, bias-free GeSn THz LAE on a Si substrate. The GeSn thin film is grown on undoped Si substrate with Ge buffer layer by reduced pressure chemical vapor deposition (RPCVD). Since the charge neutrality level is close to the top of the valence band, a built-in electric field at the surface of GeSn is created by the fermi-level pinning. As the optical absorption coefficient of the GeSn ultrafast photoconductor is higher than 7000 cm-1 in the 1500 – 1700 nm wavelength range, it can generate a comparable amount of photocarriers as InGaAs-based ultrafast photoconductor. To investigate the broadband operation capability of the bias-free GeSn THz LAE prototypes, we further characterize the carrier dynamics of the epitaxial GeSn thin film. At the optical pump power of 400 mW, the bias-free GeSn THz LAE generates broadband THz radiation with a pulse width of 500 fs full width at half maximum. The GeSn THz LAE can be monolithically integrated on Si photonic platform with the bias-free operation. It paves the way toward THz system-on-chip (SoC) for many on-site applications in non-destructive evaluation, biomedical imaging, and industrial inspections.
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