Dr. Latifa Desvoivres Profile

Dr. Latifa Desvoivres

R&D Senior Etch Engineer at STMicroelectronics

SPIE Involvement:

Author

Publications (4)

SPIE Journal Paper | 10 April 2015

Patterning critical dimension control for advanced logic nodes

Bertrand Le-Gratiet, Jean De-Caunes, Maxime Gatefait, Auguste Lam, Alain Ostrovsky, Jonathan Planchot, Vincent Farys, Julien Ducoté, Marc Mikolajczak, Vincent Morin, Nicolas Chojnowski, Frank Sundermann, Alice Pelletier, Regis Bouyssou, Cedric Monget, Jean-Damien Chapon, Bastien Orlando, Laurene Babaud, Céline Lapeyre, Emek Yesilada, Anna Szucs, Jean-Christophe Michel, Latifa Desvoivres, Onintza Ros Bengoechea, Pascal Gouraud

JM3, Vol. 14, Issue 02, 021103, (April 2015) https://doi.org/10.1117/12.10.1117/1.JMM.14.2.021103

KEYWORDS: Semiconducting wafers, Optical lithography, Critical dimension metrology, Process control, Photomasks, Etching, Logic, Metrology, Lithography, Optical proximity correction

Read Abstract +

Proceedings Article | 28 March 2014 Paper

Plasma etching and integration challenges using alternative patterning techniques for 11nm node and beyond

S. Barnola, P. Pimenta Barros, C. Arvet, C. Vizioz, N. Posseme, A. Gharbi, M. Argoud, R. Tiron, J. Pradelles, L. Desvoivres, S. Barraud

Proceedings Volume 9054, 90540E (2014) https://doi.org/10.1117/12.2046251

KEYWORDS: Etching, Electron beam lithography, Polymethylmethacrylate, Silicon, Picosecond phenomena, Photomasks, Chemistry, Lithography, System on a chip, Metals

Read Abstract +

Proceedings Article | 28 March 2014 Paper

28nm FDSOI high-K metal gate CD variability investigation

L. Desvoivres, P. Gouraud, B. Le Gratiet, R. Bouyssou, R. Ranica, C. Gallon, I. Thomas

Proceedings Volume 9054, 905408 (2014) https://doi.org/10.1117/12.2045904

KEYWORDS: Metals, Etching, Magnesium, Scatterometry, Silicon, Semiconducting wafers, Transmission electron microscopy, Control systems, Diffractive optical elements, Capacitance

Read Abstract +

Proceedings Article | 10 April 2013 Paper

28nm FD-SOI metal gate profile optimization, CD and undercut monitoring using scatterometry measurement

R. Bouyssou, B. Le Gratiet, P. Gouraud, L. Desvoivres, G. Briend, B. Dumont

Proceedings Volume 8681, 86810R (2013) https://doi.org/10.1117/12.2010746

KEYWORDS: Etching, Critical dimension metrology, Transmission electron microscopy, Metals, Scatterometry, Lithography, Diffractive optical elements, Semiconducting wafers, 3D acquisition, 3D modeling

Read Abstract +

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years