Dr. Gabriele Schrag Profile

Dr. Gabriele Schrag

Head of MEMS Research Group at Technische Univ Muenchen

SPIE Involvement:

Author

Proceedings Article | 2 June 2017 Presentation + Paper

Efficient fluid transport by a bionically inspired micro-flapper: fluidic investigations using fully coupled finite element simulation

R. Behlert, G. Schrag, G. Wachutka

Proceedings Volume 10246, 102460A (2017) https://doi.org/10.1117/12.2266252

KEYWORDS: Microfluidics, Actuators, Convection, Motion models, Device simulation, Optimization (mathematics), Sensors, Resonators, Modeling and simulation, Microsystems, Solids, Electrodes, Phase shifts, Aluminum nitride, Silicon, Thin films, Computer simulations

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Proceedings Article | 30 May 2017 Presentation + Paper

Modeling high signal-to-noise ratio in a novel silicon MEMS microphone with comb readout

Johannes Manz, Alfons Dehe, Gabriele Schrag

Proceedings Volume 10246, 1024608 (2017) https://doi.org/10.1117/12.2266014

KEYWORDS: Signal to noise ratio, Microelectromechanical systems, Silicon, Microfluidics, Signal attenuation, Motion models, Acoustics, Calibration, Modeling and simulation, Capacitance, Resistance, Electroluminescence, Transducers

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Proceedings Article | 21 May 2015 Paper

Modeling distributed electrostatic effects in silicon microphones and their impact on the performance

Thomas Kuenzig, Gabriele Schrag, Alfons Dehé, Gerhard Wachutka

Proceedings Volume 9517, 95171L (2015) https://doi.org/10.1117/12.2180898

KEYWORDS: Capacitance, Calibration, Finite element methods, Silicon, Distortion, Performance modeling, Instrument modeling, Microfluidics, Capacitors, Data modeling

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Proceedings Article | 21 May 2015 Paper

Wafer edge protection kit for MEMS and TSV Si-etching

Robert Wieland, K. Nguyen, U. Seidelmann, M. Scholz, G. Schrag

Proceedings Volume 9517, 951724 (2015) https://doi.org/10.1117/12.2180135

KEYWORDS: Semiconducting wafers, Etching, Microelectromechanical systems, Sensors, Deep reactive ion etching, Photomasks, Silicon, Visualization, Plasma, Ceramics

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Proceedings Article | 21 May 2015 Paper

Acoustic high-frequency effects inside the package of capacitive silicon microphones and their impact on the device performance

G. Schrag, T. Kuenzig, D. Pham, C. Glacer, A. Dehé, G. Wachutka

Proceedings Volume 9517, 95170M (2015) https://doi.org/10.1117/12.2179888

KEYWORDS: Acoustics, Resonators, Silicon, Microfluidics, Performance modeling, Signal to noise ratio, Transducers, Instrument modeling, Neck, Data modeling

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Proceedings Article | 5 May 2011 Paper

Mechanical contact in system-level models of electrostatically actuated RF-MEMS switches: experimental analysis and modeling

Martin Niessner, Jacopo Iannacci, Gabriele Schrag

Proceedings Volume 8066, 80660Y (2011) https://doi.org/10.1117/12.887389

KEYWORDS: Switches, Data modeling, Electrodes, Dielectrics, Mathematical modeling, Microelectromechanical systems, Superposition, Device simulation, Ion beams, Performance modeling

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