Dr. Joerg Thiele Profile

Dr. Joerg Thiele

SPIE Involvement:

Author

Publications (23)

Proceedings Article | 20 March 2006 Paper

Verifying high NA polarization OPC treatment on wafer

Ralph Schlief, Mario Hennig, Rainer Pforr, Jörg Thiele, Max Hoepfl

Proceedings Volume 6154, 61543F (2006) https://doi.org/10.1117/12.656621

KEYWORDS: Optical proximity correction, Polarization, Data modeling, Scanners, SRAF, Photomasks, Semiconducting wafers, Process modeling, Printing, Scanning electron microscopy

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Proceedings Article | 14 March 2006 Paper

Call for an industry standard for pattern transfer models for usage in OPC and design for manufacturability

Thomas Roessler, Wolfgang Grimm, Jörg Thiele

Proceedings Volume 6156, 615607 (2006) https://doi.org/10.1117/12.652682

KEYWORDS: Optical proximity correction, Electronic design automation, Design for manufacturing, Product engineering, Standards development, Device simulation, Semiconductors, Design for manufacturability, Manufacturing, Data modeling

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Proceedings Article | 13 March 2006 Paper

Annotated layout optimization

Jörg Thiele, Roderick Köhle

Proceedings Volume 6156, 615605 (2006) https://doi.org/10.1117/12.656428

KEYWORDS: Optical proximity correction, Critical dimension metrology, Manufacturing, SRAF, Capacitance, Resolution enhancement technologies, Semiconducting wafers, Photomasks, Data processing, Design for manufacturability

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Proceedings Article | 5 November 2005 Paper

OPC with customized asymmetric pupil illumination fill

Christof Bodendorf, Jens Haßmann, Thomas Mülders, Karin Kurth, Jörg Thiele

Proceedings Volume 5992, 599224 (2005) https://doi.org/10.1117/12.632159

KEYWORDS: Optical proximity correction, Silicon, Data modeling, Diffusion, Process modeling, Photomasks, Semiconducting wafers, Lithographic illumination, Anisotropy, Distortion

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Proceedings Article | 28 June 2005 Paper

Simulation based OPC for contact pattern using 193 nm lithography

Martin Keck, Christof Bodendorf, Jorg Thiele, Alberto Gomez, Ying-Chung Tseng, Teng-Yen Huang

Proceedings Volume 5853, (2005) https://doi.org/10.1117/12.617215

KEYWORDS: Optical proximity correction, Photomasks, Data modeling, Semiconducting wafers, Lithography, Printing, Scanning electron microscopy, Critical dimension metrology, Manufacturing, Phase shifts

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Proceedings Article | 12 May 2005 Paper

OPC for double exposure lithography

Thorsten Winkler, Wolfgang Dettmann, Mario Hennig, Wolfram Koestler, Molela Moukara, Joerg Thiele, Karsten Zeiler

Proceedings Volume 5754, (2005) https://doi.org/10.1117/12.599441

KEYWORDS: Optical proximity correction, Lithography, Photomasks, Lithographic illumination, Optical lithography, Metals, Semiconducting wafers

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Proceedings Article | 12 May 2005 Paper

Defect printability and inspectability of Cr-less phase-shift masks for the 70nm node

J. Heumann, J. Schramm, A. Birnstein, K. Park, T. Witte, N. Morgana, M. Hennig, R. Pforr, J. Thiele, N. Schmidt, C. Aquino

Proceedings Volume 5754, (2005) https://doi.org/10.1117/12.601568

KEYWORDS: Photomasks, Quartz, Semiconducting wafers, Inspection, Bridges, Defect inspection, Resolution enhancement technologies, Scanning electron microscopy, Critical dimension metrology, Manufacturing

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Proceedings Article | 5 May 2005 Paper

Geometrical analysis of product layout as a powerful tool for DFM

Thomas Roessler, Joerg Thiele

Proceedings Volume 5756, (2005) https://doi.org/10.1117/12.595062

KEYWORDS: Optical proximity correction, Transistors, Design for manufacturing, Critical dimension metrology, Design for manufacturability, Manufacturing, Logic, Diffusion, Control systems, Resolution enhancement technologies

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Proceedings Article | 2 June 2004 Paper

Contact layer printing using alternating phase-shifting masks: mask making, patterning results, and production implementation

Rainer Pforr, Wolfgang Dettmann, M. Eisenhut, Mario Hennig, Detlef Hofmann, Joerg Thiele, Guido Thielscher

Proceedings Volume 5504, (2004) https://doi.org/10.1117/12.568032

KEYWORDS: Manufacturing, Overlay metrology, Photomasks, Etching, Phase shifts, Scanners, Critical dimension metrology, Quartz, Mask making, Optical lithography

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Proceedings Article | 28 May 2004 Paper

Hard phase-shifting masks for the 65-nm node: a performance comparison

Rainer Pforr, Mario Hennig, Roderick Koehle, Nicolo Morgana, Joerg Thiele, Jens Weckesser

Proceedings Volume 5377, (2004) https://doi.org/10.1117/12.534091

KEYWORDS: Photomasks, Critical dimension metrology, Phase shifts, Printing, Etching, Lithography, Optical lithography, Chromium, Resolution enhancement technologies, Scanning electron microscopy

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Proceedings Article | 17 December 2003 Paper

High-accuracy simulation-based optical proximity correction

Martin Keck, Thomas Henkel, Ralf Ziebold, Christian Crell, Jörg Thiele

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.517462

KEYWORDS: Optical proximity correction, Data modeling, Photomasks, Scanning electron microscopy, Printing, Manufacturing, Semiconducting wafers, Critical dimension metrology, Lithography, Data processing

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Proceedings Article | 10 July 2003 Paper

Improved manufacturability by OPC based on defocus data

Jorg Thiele, Ines Anke, Henning Haffner, Armin Semmler

Proceedings Volume 5042, (2003) https://doi.org/10.1117/12.485251

KEYWORDS: Optical proximity correction, Critical dimension metrology, Photomasks, Semiconducting wafers, Manufacturing, Tolerancing, Lithography, Silicon, Image transmission, Scanning electron microscopy

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Proceedings Article | 26 June 2003 Paper

Full-level alternating PSM for sub-100nm DRAM gate patterning

Rainer Pforr, Marco Ahrens, Wolfgang Dettmann, Mario Hennig, Roderick Koehle, Burkhard Ludwig, Nicolo Morgana, Joerg Thiele

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.485521

KEYWORDS: Critical dimension metrology, Photomasks, Optical lithography, Lithography, Optical proximity correction, Mask making, Phase shifts, Semiconducting wafers, Etching, Resolution enhancement technologies

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Proceedings Article | 30 July 2002 Paper

Introduction of full-level alternating phase-shift mask technology into IC manufacturing

Joerg Thiele, Marco Ahrens, Wolfgang Dettmann, M. Heissmeier, Mario Hennig, Burkhard Ludwig, Molela Moukara, Rainer Pforr

Proceedings Volume 4691, (2002) https://doi.org/10.1117/12.474639

KEYWORDS: Photomasks, Optical proximity correction, Semiconducting wafers, Calibration, Critical dimension metrology, Lithography, Phase shifts, Data modeling, Manufacturing, Optical calibration

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Proceedings Article | 22 January 2001 Paper

Mask manufacturing rule check: how to save money in your mask shop

Martin Keck, Wolfram Ziegler, Roman Liebe, Torsten Franke, Gerd Ballhorn, Matthias Koefferlein, Joerg Thiele

Proceedings Volume 4186, (2001) https://doi.org/10.1117/12.410681

KEYWORDS: Inspection, Photomasks, Manufacturing, Optical proximity correction, Inspection equipment, Computed tomography, Detection and tracking algorithms, Bridges, Tungsten, Silver

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Proceedings Article | 5 July 2000 Paper

Simulation-based method for sidelobe supression

Christoph Dolainsky, Paul Karakatsanis, Fritz Gans, Rainer Pforr, Joerg Thiele

Proceedings Volume 4000, (2000) https://doi.org/10.1117/12.388952

KEYWORDS: Photomasks, Lithography, Computer simulations, Printing, Phase shifts, Image transmission, Transmittance, Optical proximity correction, Scanning electron microscopy, Manufacturing

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Proceedings Article | 5 July 2000 Paper

Simulation-based proximity correction in high-volume DRAM production

Werner Fischer, Ines Anke, Giorgio Schweeger, Joerg Thiele

Proceedings Volume 4000, (2000) https://doi.org/10.1117/12.389078

KEYWORDS: Optical proximity correction, Calibration, Manufacturing, Process modeling, Silicon, Lithography, Diffusion, Photomasks, Image processing, Inspection

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Proceedings Article | 30 December 1999 Paper

Absorbing assist pattern technique (A2PT) for effective sidelobe control for attenuated phase-shifting masks in optical projection lithography

Rainer Pforr, Fritz Gans, Juergen Knobloch, Joerg Thiele

Proceedings Volume 3873, (1999) https://doi.org/10.1117/12.373289

KEYWORDS: Photomasks, Chromium, Printing, Phase shifts, Transmittance, Mask making, Projection lithography, Deep ultraviolet, Image transmission, Double patterning technology

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Proceedings Article | 30 December 1999 Paper

Proximity effects of alternating phase-shift masks

Wilhelm Maurer, Christoph Friedrich, Leonhard Mader, Joerg Thiele

Proceedings Volume 3873, (1999) https://doi.org/10.1117/12.373330

KEYWORDS: Optical proximity correction, Photomasks, Lithography, Phase shifts, Chromium, Optical lithography, Etching, Printing, Deep ultraviolet, Semiconducting wafers

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Proceedings Article | 26 July 1999 Paper

Integration of alternating phase-shift mask technology into optical proximity correction

Joerg Thiele, Christoph Friedrich, Christoph Dolainsky, Paul Karakatsanis, Wilhelm Maurer

Proceedings Volume 3679, (1999) https://doi.org/10.1117/12.354367

KEYWORDS: Optical proximity correction, Chromium, Phase shifts, Photomasks, Critical dimension metrology, Lithography, Binary data, Image segmentation, Computer simulations, Printing

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Proceedings Article | 29 June 1998 Paper

Process proximity correction using an automated software tool

Wilhelm Maurer, Christoph Dolainsky, Joerg Thiele, Christoph Friedrich, Paul Karakatsanis

Proceedings Volume 3334, (1998) https://doi.org/10.1117/12.310754

KEYWORDS: Process modeling, Data modeling, Optical proximity correction, Photomasks, Software development, Lithography, Mask making, Data processing, Mathematical modeling, Reticles

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Proceedings Article | 29 June 1998 Paper

Benchmarking of software tools for optical proximity correction

Angelika Jungmann, Joerg Thiele, Christoph Friedrich, Rainer Pforr, Wilhelm Maurer

Proceedings Volume 3334, (1998) https://doi.org/10.1117/12.310721

KEYWORDS: Optical proximity correction, Photomasks, Data modeling, Logic, Semiconducting wafers, Mask making, Inspection, Data processing, Etching, Resistance

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Proceedings Article | 12 February 1997 Paper

Comparison of line shortening assessed by aerial image and wafer measurements

Wolfram Ziegler, Rainer Pforr, Joerg Thiele, Wilhelm Maurer

Proceedings Volume 3236, (1997) https://doi.org/10.1117/12.301203

KEYWORDS: Photomasks, Head, Semiconducting wafers, Atomic force microscopy, Reticles, Deep ultraviolet, OLE for process control, Data corrections, Critical dimension metrology, Lithography

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